Proximity and Tactile Sensor Using Self-Capacitance Measurement for Human Collaboration Robots

2018 ◽  
Vol 138 (1) ◽  
pp. 2-8 ◽  
Author(s):  
Satoshi Tsuji ◽  
Teruhiko Kohama
Sensors ◽  
2018 ◽  
Vol 18 (7) ◽  
pp. 2374 ◽  
Author(s):  
Mitsutoshi Makihata ◽  
Masanori Muroyama ◽  
Shuji Tanaka ◽  
Takahiro Nakayama ◽  
Yutaka Nonomura ◽  
...  

Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety. The crucial technological barrier is to package force sensor and communication function in a small volume. In this paper, we propose the novel device structure based on a wafer bonding technology to integrate and package capacitive force sensor using silicon diaphragm and an integrated circuit separately manufactured. Unique fabrication processes are developed, such as the feed-through forming using a dicing process, a planarization of the Benzocyclobutene (BCB) polymer filled in the feed-through and a wafer bonding to stack silicon diaphragm onto ASIC (application specific integrated circuit) wafer. The ASIC used in this paper has a capacitance measurement circuit and a digital communication interface mimicking a tactile receptor of a human. We successfully integrated the force sensor and the ASIC into a 2.5 × 2.5 × 0.3 mm die and confirmed autonomously transmitted packets which contain digital sensing data with the linear force sensitivity of 57,640 Hz/N and 10 mN of data fluctuation. A small stray capacitance of 1.33 pF is achieved by use of 10 μm thick BCB isolation layer and this minimum package structure.


2014 ◽  
Vol 134 (12) ◽  
pp. 400-405 ◽  
Author(s):  
Satoshi Tsuji ◽  
Teruhiko Kohama

2014 ◽  
Vol E97.C (11) ◽  
pp. 1117-1123 ◽  
Author(s):  
Katsuhiro TSUJI ◽  
Kazuo TERADA ◽  
Ryota KIKUCHI

2011 ◽  
Vol 25 (2) ◽  
pp. 129-134
Author(s):  
Guanghui Cao ◽  
Ying Huang ◽  
Wu Zhang ◽  
Caixia Liu

2013 ◽  
Vol 27 (1) ◽  
pp. 57-63
Author(s):  
Ying Huang ◽  
Wei Miao ◽  
Leiming Li ◽  
Wenting Cai ◽  
Qinghua Yang ◽  
...  
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