Melting and Laser Annealing in Semiconductors using 0.485 μm and 0.193 μm Pulsed Lasers
Keyword(s):
ABSTRACTAnnealing of displacement damage, the dissolution of boron precipitates, the formation of constitution supercooling cells, and the broadening of dopant profiles have been studied in laser annealed silicon. These samples were irradiated with a dye laser (λ = 0.485 µm, τ = 9 ns, E = 0.7–1.2 J cm−2) and an Excimer laser (λ = 0.193 µm, τ= 9 ns, E = 0.5–0.7 J cm−2) pulses. These results can be consistently interpreted by invoking melting during pulsed laser irradiation. Thus these results provide convincing evidence for the melting phenomenon.
Keyword(s):
1981 ◽
Vol 43
(6)
◽
pp. 1515-1535
◽
1983 ◽
Vol 44
(C5)
◽
pp. C5-449-C5-454
◽
Keyword(s):
1983 ◽
Vol 44
(C5)
◽
pp. C5-23-C5-36
◽