Science Underlying Radioactive Waste Management: Status and Needs-Twenty Years Later

1996 ◽  
Vol 465 ◽  
Author(s):  
Rustum Roy

ABSTRACTThe setting of the technical subsystem within the overall socio-political-economic-technical radwaste system will be described and the highly interactive nature of the larger setting emphasized. It will be shown that because of the dominance of the socio-political subsystem, the importance of the technical subsystem is overshadowed. Moreover the key issue in the technical subsystem, whether to put more reliance on the immobilization (via the waste package or engineeered barriers) or the isolation (via the geology) has stayed tilted toward the latter since 1978, when we organized the first symposium on radwaste science (at the Materials Research Society meeting). Now that the isolation strategy is stymied, the opportunity arises again for the materials community to make a compelling case for the waste package's true significance.This review is made mainly from the perspective of one laboratory in one country, the U.S. What is remarkable about the state of research in the technical subsystem is how little the big picture of the science or the technology has changed after some billions spent on R/D. The borosilicate glass (almost unchanged) is still the establishment's choice of reference waste form for HLW Cost, however, is finally forcing cement encapsulated forms to be given a second look. Mineral-modeled ceramics have received a great deal of scientific attention but remain esoteric to managers. It will be shown that in the author's opinion an enormous amount of detailed science has been done but most of it is unlikely to prove to be of any relevance or use. The policy implications for future R/D are discussed.

1998 ◽  
Vol 518 ◽  
Author(s):  
W. N. Sharpe ◽  
S. Brown ◽  
G. C. Johnson ◽  
W. Knauss

AbstractThe Young's modulus and strength of polysilicon specimens manufactured in the same production run were measured in four different laboratories. Specimens subjected to in-plane bending were tested at U. C. Berkeley and at Failure Analysis Associates, and tensile measurements were made at Caltech and Johns Hopkins. All specimens were produced at the Microelectronics Center of North Carolina (MCNC).In bending, the Young's modulus for specimens nominally 2 µm thick was measured as 174 GPa and 137 GPa; whereas in tension, a value of 132 GPa was obtained. Modulus values of 136 GPa and 142 GPa were measured in tension on specimens nominally 1.5 µm and 3.5 µm thick. Strengths of the brittle polysilicon were 2.8 and 2.7 GPa in bending and 1.3 GPa for both thicknesses in tension.These preliminary results were presented at Symposium N - Microelectromechanical Structures for Materials Research at the Materials Research Society meeting in April 1998. This paper is a short overview of the test methods — each of which is described elsewhere — and a documentation of the results presented at that time.


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