Chemical Wear of Cu CMP

2000 ◽  
Vol 613 ◽  
Author(s):  
Hong Liang
Keyword(s):  
Copper Oxide ◽  
Surface Analysis ◽  
Field Emission ◽  
Wear Mechanisms ◽  
Abrasive Particles ◽  
X Ray ◽  
Analysis Techniques ◽  
Analytical Tem ◽  
Surface Analysis Techniques ◽  
Cu Cmp

In this work, we used surface analysis techniques, such as a field-emission highresolution analytical TEM, X-ray spectroscopy, and XPS to analyze abrasive particles after polishing. Results showed evidence of copper oxide (Cu2O) in the polished slurry. However, there was no metallic crystalline copper detected. After comparing these data with the results obtained from our electro-chemical experiments, we propose two possible chemical wear mechanisms in Cu CMP.

Transferwear During Cu CMP

2003 ◽  
Vol 767 ◽  
Author(s):  
H. Liang ◽  
G. Helen Xu ◽  
J.M. Martin ◽  
Th. Le Mongne
Keyword(s):  
Surface Analysis ◽  
Water Molecules ◽  
Interfacial Interactions ◽  
Analysis Techniques ◽  
Fundamental Investigation ◽  
Surface Analysis Techniques ◽  
Pad Wear ◽  
Cu Cmp ◽  
Wear Modes

We conducted fundamental investigation of interfacial interactions between copper and polyurethane surfaces. Using in situ surface analysis techniques we were able to evaluate effects of water molecules on both materials surfaces during rubbing. Evidence of transferring elements between copper and urethane surfaces due to friction was found. Further investigation on pad wear indicated that transfer wear was taking a major role during copper CMP and mixed wear modes dominated pad wear.

scholarly journals Advantages and Limitations of Surface Analysis Techniques on Plasma-Treated Arabidopsis thaliana Seeds

2021 ◽  
Vol 8 ◽  
Author(s):  
Alexandra Waskow ◽  
Alan Howling ◽  
Ivo Furno
Keyword(s):  
Contact Angle ◽  
Arabidopsis Thaliana ◽  
Surface Analysis ◽  
Photoelectron Spectroscopy ◽  
Surface Characterization ◽  
Attenuated Total Reflection ◽  
X Ray ◽  
Force Microscopy ◽  
Analysis Techniques ◽  
Surface Analysis Techniques

Surface characterization of plasma-treated seeds has made significant progress over the last decade. Most papers in the literature use scanning electron microscopy (SEM) and contact angle goniometry to investigate surface modifications. However, very few papers address the chemical modifications to the seed coat after plasma treatment. Here, a summary of the methods used to analyze plasma-treated seeds is presented, such as SEM, contact angle goniometry, energy-dispersive X-ray spectroscopy (EDX), X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and attenuated total reflection Fourier transform infrared spectroscopy (ATR-FTIR). The results obtained on Arabidopsis thaliana Col-0 seeds and the limitations of these techniques are discussed. An experiment was designed in order to compare the relative advantages and limitations of these surface analysis techniques by investigating the separate effects of plasma, heat, and ozone on A. thaliana seeds.

ESCA for microelectronic applications

1983 ◽  
Vol 41 ◽  
pp. 168-169
Author(s):  
J. F. Moulder ◽  
J. M. Burkstrand ◽  
C. D. Wagner
Keyword(s):  
Surface Analysis ◽  
Photoelectron Spectroscopy ◽  
Structural Information ◽  
Ion Scattering ◽  
X Ray ◽  
Analysis Techniques ◽  
Microelectronic Devices ◽  
Surface Analysis Techniques ◽  
Ion Scattering Spectroscopy ◽  
Secondary Ion

As the dimensions of microelectronic devices continue to shrink, the use of surface sensitive analysis techniques to characterize thin film structures continues to grow. These techniques including: ESCA or XPS (X-ray photoelectron spectroscopy), AES (Auger electron spectroscopy), SIMS (secondary ion mass spectroscopy) and ISS (ion scattering spectroscopy) are now routinely being used to study a wide variety of material and process related problems.ESCA, which has become a standard analytical tool in the chemical industry, has not been utilized in the microelectronic industry to the extent that AES and SIMS have, even though it has the potential to provide more chemical state and structural information than other surface analysis techniques.ESCA like the other surface analysis techniques analyzes the outermost atomic layers of a solid surface (typically 5 to 50 Å in depth). A low energy X-ray source (Mg 1253.6 eV or Al 1486.7 eV) is used to bombard the sample causing electrons to be ejected from it. These photo-electrons are collected and analyzed to determine their kinetic energy.

scholarly journals Introduction to Surface Analysis Techniques of Aluminum

2015 ◽  
Vol 64 (7) ◽  
pp. 285-288
Author(s):  
Kenji Nose ◽  
Mai Tomino
Keyword(s):  
Surface Analysis ◽  
Analysis Techniques ◽  
Surface Analysis Techniques

scholarly journals Surface Analysis by MeV Ion Beams and Microscopy

2009 ◽  
Vol 15 (S3) ◽  
pp. 87-88
Author(s):  
José A. R. Pacheco de Carvalho ◽  
Cláudia F. F. P. R. Pacheco ◽  
António D. Reis
Keyword(s):  
Surface Analysis ◽  
Nuclear Reactions ◽  
Ion Beam ◽  
Ion Beams ◽  
Analysis Method ◽  
Analysis Techniques ◽  
Target Composition ◽  
Nuclear Techniques ◽  
Surface Analysis Techniques ◽  
Wide Range

AbstractMaterial analysis, specially surface analysis of materials, has been increasingly important. A wide range of surface analysis techniques is available. The techniques are, generally, complementary. There are nuclear and non-nuclear techniques, e.g. microscopy. Nuclear techniques, which are nondestructive, permit analysis for a few microns near the surface. They have been applied to areas such as scientific, technologic, industry, arts and medicine, using MeV ion beams. Nuclear reactions permit to achieve high sensitivities for detection of light elements in heavy substrates and also discrimination of isotopes. We use ion-ion nuclear reactions, elastic scattering and the energy analysis method, where an energy spectrum is obtained of ions from the target for a chosen energy of the incident ion beam. The target composition and concentration profile information contained in the spectrum is computationally obtained through a computer program that has been developed for predicting such energy spectra. Predicted spectra obtained for variations of target parameters are compared with experimental data, giving that information. SEM and TEM are also used.

A study of the initial oxidation of polycrystalline Si using surface analysis techniques

1981 ◽  
Vol 18 (3) ◽  
pp. 960-964 ◽  
Author(s):  
L. L. Kazmerski ◽  
O. Jamjoum ◽  
P. J. Ireland ◽  
R. L. Whitney
Keyword(s):  
Surface Analysis ◽  
Initial Oxidation ◽  
Analysis Techniques ◽  
Surface Analysis Techniques

Discrimination between adsorption and coprecipitation in aquatic particle standards by surface analysis techniques: lead distributions in calcium carbonates

1988 ◽  
Vol 22 (4) ◽  
pp. 463-467 ◽  
Author(s):  
Julia E. Fulghum ◽  
Scott R. Bryan ◽  
Richard W. Linton ◽  
Christopher F. Bauer ◽  
Dieter P. Griffis
Keyword(s):  
Surface Analysis ◽  
Calcium Carbonates ◽  
Analysis Techniques ◽  
Surface Analysis Techniques
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