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Effects of aging time in hydrogen peroxide-glycine-based Cu CMP slurry

2022 ◽  
Vol 140 ◽  
pp. 106343
Author(s):  
Juhwan Kim ◽  
Donggeon Kwak ◽  
Jungjae Park ◽  
Takayuki Kubota ◽  
Taesung Kim
Keyword(s):  
Hydrogen Peroxide ◽  
Aging Time ◽  
Effects Of Aging ◽  
Cu Cmp

Investigation of 2-Way Injection Method on Cu CMP Process

2021 ◽  
Vol MA2021-01 (20) ◽  
pp. 809-809
Author(s):  
Juhwan Kim ◽  
Chulwoo Bae ◽  
Donggeon Kwak ◽  
Seungjujn Oh ◽  
Taesung Kim
Keyword(s):  
Injection Method ◽  
Cu Cmp

Pattern Loading Effect Optimization of BEOL Cu CMP in 14nm Technology Node

2020 ◽  
Author(s):  
Lei Zhang ◽  
Yuanyuan Meng ◽  
Yi Xian ◽  
Wei Zhang ◽  
Haifeng Zhou ◽  
...  
Keyword(s):  
Loading Effect ◽  
Technology Node ◽  
Cu Cmp

Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP

2020 ◽  
Vol 586 ◽  
pp. 124286 ◽  
Author(s):  
Qi Wang ◽  
Da Yin ◽  
Baohong Gao ◽  
Siyu Tian ◽  
Xiaoqin Sun ◽  
...  
Keyword(s):  
Residue Removal ◽  
Cleaning Solution ◽  
Cu Cmp

Post Cu-CMP Engineering Challenges for the 65 nm Technology Nodes and Beyond

2019 ◽  
Vol 11 (2) ◽  
pp. 431-440 ◽  
Author(s):  
Sebastien Petitdidier ◽  
Maxime Mellier ◽  
Denis Guiheux ◽  
Marc Juhel
Keyword(s):  
Technology Nodes ◽  
Cu Cmp

Elimination of Post Cu-CMP Watermark by Optimizing Post CMP Clean to Control Cu Dissolution

2019 ◽  
Vol 11 (2) ◽  
pp. 387-394 ◽  
Author(s):  
Sebastien Petitdidier ◽  
Maxime Mellier ◽  
Chantal Trouiller ◽  
Catherine Euvrard ◽  
Marc Juhel
Keyword(s):  
Cu Cmp ◽  
Cu Dissolution
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