Evaluation on Stress and Optical Property of Thin Films Used in Optical MEMS Device

ABSTRACTControl of the film stress and optical property has long been considered as an issue in the tunable optical MEMS (Micro-Electro-Mechanical Systems) devices. In this paper, the atmospheric evolution of Titanium Dioxide (TiO2) and Silicon Dioxide (SiO2) thin films for the optical MEMS devices were studied. These films were prepared by ion-assisted e-beam evaporation. It is found that as-deposited SiO2 films exhibit compressive stress; whereas, it is tensile in the TiO2 films under present processing conditions. When annealed at 150 °C, both SiO2 and TiO2 films show slight changes in stress with annealing time. However, increasing the anneal temperature to 250°C caused an apparent change of film stresses with time, in which SiO2 film turns into less compressive and TiO2 film appears to be more tensile. The optical properties after annealing were also investigated by measuring the thickness and the refractive index changes using the spectroscopic ellipsometry technique. At both experimental temperatures, the film thickness increases slightly and the refractive index at 1550 nm decreases a little at the initial annealing stage for SiO2 films. For TiO2 films, it is found that the refractive index increases after annealing at 250°C. This might be caused by the TiO2 film densification process during amorphous-to-crystalline phase transformation. Because most of the significant film evolutions occur during the initial 12 hours of annealing, a practical way of stabilizing the film properties in a MEMS device is to pre-anneal the as-deposited thin films.