APPLICABILITY OF COLUMN DEVICES TO MEASURE THERMAL PROPERTIES IN POROUS MEDIA

2014 ◽  
Vol 2014 (2) ◽  
pp. 50-59
Author(s):  
C. M. Rubio ◽  
◽  
Keyword(s):  
Porous Media ◽  
Thermal Properties

A new model for the non-steady-state probe method to measure thermal properties of porous media

1989 ◽  
Vol 32 (8) ◽  
pp. 1473-1481 ◽  
Author(s):  
W.K.P. van Loon ◽  
I.A. van Haneghem ◽  
J. Schenk
Keyword(s):  
Porous Media ◽  
Thermal Properties ◽  
Steady State ◽  
Probe Method ◽  
New Model

Inclusion Problems

1988 ◽  
Vol 41 (1) ◽  
pp. 15-20 ◽  
Author(s):  
Toshio Mura
Keyword(s):  
Porous Media ◽  
Thermal Properties ◽  
Stress Intensity ◽  
Composite Materials ◽  
Stress Intensity Factors ◽  
Elastic Moduli ◽  
Transformation Toughening ◽  
Dynamic Effects ◽  
Intensity Factors ◽  
Inclusion Problems

The present review on inclusion problems emphasizes papers published after 1982. Materials associated with inclusions are composite materials, precipitated or transformed alloys, porous media, and polycrystals. The inclusion problems deal with the following subjects of these materials: (1) average elastic moduli and average thermal properties; (2) nonelastic constitutive equations; (3) behavior of inclusions including nucleation, growth, and collapse of voids; (4) cracks and inclusions including the transformation toughening, crack growth through composites and stress intensity factors; (5) sliding and debonding inclusions; and (6) dynamic effects of inclusions.

Transient method for measuring thermal properties of saturated porous media

1993 ◽  
Vol 36 (10) ◽  
pp. 2565-2573 ◽  
Author(s):  
Osvair V. Trevisan ◽  
Sitakanta Mohanty ◽  
Mark A. Miller
Keyword(s):  
Porous Media ◽  
Thermal Properties ◽  
Saturated Porous Media ◽  
Transient Method

scholarly journals Effects of heat sink compounds on contact resistance of porous media

2007 ◽  
Vol 11 (4) ◽  
pp. 113-124 ◽  
Author(s):  
Olukayode Akinyemi ◽  
Thomas Sauer
Keyword(s):  
Thermal Conductivity ◽  
Porous Media ◽  
Thermal Properties ◽  
Thermal Diffusivity ◽  
Contact Resistance ◽  
Heat Sink ◽  
Thermal Probe ◽  
Dry Conditions ◽  
Thermal Grease ◽  
Water Contents

High and low-conductivity heat sink compounds were applied in succession on a thermal probe, which was then used to determine the thermal conductivity and thermal diffusivity of some porous media at room temperature. The experiment was conducted separately under different packing densities and water contents to see the effects of the heat sink compounds on the thermal properties at such conditions. High conductivity grease increased the values of thermal conductivity considerably and thus reduces the contact resistance, with increase in bulk density at air-dry conditions, but had virtually no effects on its thermal diffusivity. It however decreased both the thermal conductivity and thermal diffusivity with water content increment. The thermal properties obtained without thermal grease vary considerably from those with the heat sink compounds as water was being applied. The variation however reduced also considerably towards saturation.

The thermal properties of some amine tetraphenylboron salts8-Quinolinol and its derivatives

1960 ◽  
Vol 23 ◽  
pp. 332-336 ◽  
Author(s):  
W WENDLANDT ◽  
J VANTASSEL ◽  
G ROBERTHORTON
Keyword(s):  
Thermal Properties
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