1994 Proceedings. 44th Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

170

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780309146

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

296 lead fine pitch (0.4 mm) thin plastic QFP package with TAB interconnect

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367652 ◽

2002 ◽

Cited By ~ 2

Author(s):

P. Jain

Keyword(s):

Fine Pitch ◽

Thin Plastic

Download Full-text

Bending and twisting of 96.5Sn3.5Ag and 97.5Pb2.5Sn solder interconnects with creep

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367493 ◽

2002 ◽

Author(s):

J.H. Lau

Keyword(s):

Solder Interconnects

Download Full-text

A reliable thermosonic wire bond of GaAs-devices analysed by infrared-microscopy

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367517 ◽

2002 ◽

Cited By ~ 1

Author(s):

S. Weiss ◽

E. Zakel ◽

H. Reichl

Keyword(s):

Infrared Microscopy ◽

Wire Bond ◽

Gaas Devices

Download Full-text

Fatigue investigation of lap shear solder joints using resistance spectroscopy

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367552 ◽

2002 ◽

Cited By ~ 7

Author(s):

C. Lizzul ◽

J.H. Constable ◽

G. Westby

Keyword(s):

Solder Joints ◽

Lap Shear

Download Full-text

Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367586 ◽

2002 ◽

Cited By ~ 12

Author(s):

J.N. Sweet ◽

D.W. Peterson ◽

J.A. Emerson

Keyword(s):

Mechanical Stress ◽

Stress Measurement ◽

Test Chip

Download Full-text

The influence of temperature and humidity on the wettability of immersion tin coated printed wiring boards

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367495 ◽

2002 ◽

Cited By ~ 1

Author(s):

U. Ray ◽

I. Artaki ◽

P.T. Vianco

Keyword(s):

Printed Wiring Boards ◽

Influence Of Temperature ◽

Temperature And Humidity ◽

Immersion Tin

Download Full-text

A surface mount, thin-film, ceramic package for high-frequency wireless application

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367612 ◽

2002 ◽

Author(s):

M.P.R. Panicker ◽

C.J. Mattei

Keyword(s):

Thin Film ◽

High Frequency ◽

Surface Mount ◽

Wireless Application

Download Full-text

Comparative compliance of a representative surface mount leadless solder connection and commercial lead designs

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367645 ◽

2002 ◽

Cited By ~ 1

Author(s):

R.W. Kotlowitz ◽

A.R. Rizzo

Keyword(s):

Surface Mount

Download Full-text

Etching defects on KOH etched silicon-implementation of silicon bench technology for low cost packaging

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367607 ◽

2002 ◽

Author(s):

H. Han ◽

R. Boudreau ◽

T. Bowen ◽

S. Tan ◽

M.L. Reed

Keyword(s):

Low Cost ◽

Etched Silicon

Download Full-text

Factors governing the selection of a microwave material for circuit design

1994 Proceedings. 44th Electronic Components and Technology Conference ◽

10.1109/ectc.1994.367541 ◽

2002 ◽

Author(s):

T.S. Laverghetta

Keyword(s):

Circuit Design ◽

Selection Of

Download Full-text

1994 Proceedings. 44th Electronic Components and Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

296 lead fine pitch (0.4 mm) thin plastic QFP package with TAB interconnect

Bending and twisting of 96.5Sn3.5Ag and 97.5Pb2.5Sn solder interconnects with creep

A reliable thermosonic wire bond of GaAs-devices analysed by infrared-microscopy

Fatigue investigation of lap shear solder joints using resistance spectroscopy

Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

The influence of temperature and humidity on the wettability of immersion tin coated printed wiring boards

A surface mount, thin-film, ceramic package for high-frequency wireless application

Comparative compliance of a representative surface mount leadless solder connection and commercial lead designs

Etching defects on KOH etched silicon-implementation of silicon bench technology for low cost packaging

Factors governing the selection of a microwave material for circuit design

1994 Proceedings. 44th Electronic Components and Technology Conference
Latest Publications