Faults Detection via Mobile Safety Inspection System

2021 ◽  
Vol 11 (3) ◽  
pp. 45-48
Author(s):  
Chew Sue Ping ◽  
Anis Shahida Niza Bt Mokhtar ◽  
Chai Zhi Ren ◽  
Wan Ariff Fadhil Wan Abdullah ◽  
Shee Hui Chien ◽  
...  
Keyword(s):  
Inspection System

Performance of Fold Inspection System

2004 ◽  
Vol 58 (3) ◽  
pp. 321-327
Author(s):  
Akihiro Terada
Keyword(s):  
Inspection System

Advanced Technology of Web Inspection System

2016 ◽  
Vol 70 (10) ◽  
pp. 1014-1016
Author(s):  
Satoshi Suzuki
Keyword(s):  
Advanced Technology ◽  
Inspection System ◽  
Web Inspection

Yield Management and SmartView Web Inspection System

2010 ◽  
Vol 64 (9) ◽  
pp. 1062-1066
Author(s):  
Shuichi Shoda
Keyword(s):  
Yield Management ◽  
Inspection System ◽  
Web Inspection

Introduction of Color Web―Inspection―System at Kishu Mill

2015 ◽  
Vol 69 (3) ◽  
pp. 240-244
Author(s):  
Hideaki Sakai
Keyword(s):  
Inspection System ◽  
Web Inspection

Methodology to Correlate Defect Reduction Systems to Electrical Test Data via Artificially Manufactured Defects

2002 ◽  
Author(s):  
Mike Santana ◽  
Alfredo V. Herrera
Keyword(s):  
Test Data ◽  
Learning Opportunities ◽  
Inspection System ◽  
Navigation Systems ◽  
Defect Inspection ◽  
Defect Reduction ◽  
Electrical Test ◽  
Important System

Abstract This paper describes a methodology for correlating physical defect inspection/navigation systems with electrical bitmap data through the fabrication of artificial defects via reticle alterations or circuit modifications using an inline FIB. The methodology chosen consisted of altering decommissioned reticles to create defects resulting in both open and shorted circuits within areas of an AMD microprocessor cache. The reticles were subsequently scanned using a KLA SL300HR StarLight inspection system to confirm their location, while wafers processed on these reticles were scanned at several layers using standard inline metrology. Finally, the wafers were electrically tested, bitmapped, and physically deprocessed. All defect data was then analyzed and cross-correlated between each system, uncovering some important system deficiencies and learning opportunities. Data and images are included to support the significance and effectiveness of such a methodology.

The Investigation of Fluorine Induced Novel Probe Marker Discoloration

2018 ◽  
Author(s):  
W.F. Hsieh ◽  
Henry Lin ◽  
Vincent Chen ◽  
Irene Ou ◽  
Y.S. Lou
Keyword(s):  
Electric Field ◽  
Dark Field ◽  
Inspection System ◽  
Automated Inspection ◽  
Stress Tests ◽  
Auger Analysis ◽  
Corrosion Film ◽  
Scan Data ◽  
Thickness Variations ◽  
One Year

Abstract This paper describes the investigation of donut-shaped probe marker discolorations found on Al bondpads. Based on SEM/EDS, TEM/EELS, and Auger analysis, the corrosion product is a combination of aluminum, fluorine, and oxygen, implying that the discolorations are due to the presence of fluorine. Highly accelerated stress tests simulating one year of storage in air resulted in no new or worsening discolorations in the affected chips. In order to identify the exact cause of the fluorine-induced corrosion, the authors developed an automated inspection system that scans an entire wafer, recording and quantifying image contrast and brightness variations associated with discolorations. Dark field TEM images reveal thickness variations of up to 5 nm in the corrosion film, and EELS line scan data show the corresponding compositional distributions. The findings indicate that fluorine-containing gases used in upstream processes leave residues behind that are driven in to the Al bondpads by probe-tip forces and activated by the electric field generated during CP testing. The knowledge acquired has proven helpful in managing the problem.

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