Optically-Amplified Scalable WDM Networks Using Acousto-Optic Filters for Amplification Gain Equalization and Signal Routing

1997 ◽  
Author(s):  
David A. Smith ◽  
Alan Willner ◽  
Kathryn Li
Keyword(s):  
Wdm Networks ◽  
Signal Routing ◽  
Gain Equalization

Pre-Adjustment Rerouting for Wavelength Defragmentation in Optical Transparent WDM Networks

2015 ◽  
Vol E98.B (10) ◽  
pp. 2014-2021
Author(s):  
Akihiro KADOHATA ◽  
Atsushi WATANABE ◽  
Akira HIRANO ◽  
Hiroshi HASEGAWA ◽  
Ken-ichi SATO
Keyword(s):  
Wdm Networks

Microhardness Testing on Via Fill Material for Via In Pad Technology

2003 ◽  
Author(s):  
Norman J. Armendariz ◽  
Carolyn McCormick
Keyword(s):  
Printed Circuit Board ◽  
Failure Modes ◽  
Strong Dependence ◽  
Circuit Board ◽  
Electrical Performance ◽  
Gravimetric Analysis ◽  
Passive Components ◽  
Root Cause ◽  
Fill Material ◽  
Signal Routing

Abstract Via in pad PCB (Printed Circuit board) technology for passive components such as chip capacitors and resistors, provides the potential for improved signal routing density and reduced PCB area. Because of these improvements there is the potential for PCB cost reduction as well as gains in electrical performance through reduced impedance and inductance. However, not long after the implementation, double digit unit failures for solder joint electrical opens due to capacitor “tombstoning” began to occur. Failure modes included via fill material (solder mask) protrusion from the via as well as “out gassing” and related “tombstoning.” This failure analysis involved investigating a strong dependence on PCB supplier and, less obviously, manufacturing site. Other factors evaluated included via fill material, drill size, via fill thermal history and via fill amount or fill percent. The factor most implicated was incomplete cure of the via fill material. Previous thermal gravimetric analysis methods to determine level of polymerization or cure did not provide an ability to measure and demonstrate via fill cure level in small selected areas or its link to the failures. As a result, there was a metrology approach developed to establish this link and root-cause the failures in the field, which was based on microhardness techniques and noncontact via fill measuring metrologies.

Minimizing Cost Grooming Policy for Static Traffic in WDM Networks

2011 ◽  
Vol 30 (9) ◽  
pp. 2242-2245
Author(s):  
Hua-xiong Yao ◽  
Zong-kai Yang
Keyword(s):  
Wdm Networks

Bi-directional add∕drop amplifier module for high-capacity WDM networks

2002 ◽  
Vol 38 (21) ◽  
pp. 1267 ◽  
Author(s):  
Hyun Deok Kim ◽  
Jeong-Hun Shin ◽  
Chang-Hee Lee
Keyword(s):  
High Capacity ◽  
Wdm Networks

A 6.5–12-GHz Balanced Variable-Gain Low-Noise Amplifier With Frequency-Selective Gain Equalization Technique

2021 ◽  
Vol 69 (1) ◽  
pp. 732-744
Author(s):  
Huiyan Gao ◽  
Nayu Li ◽  
Min Li ◽  
Shaogang Wang ◽  
Zijiang Zhang ◽  
...  
Keyword(s):  
Low Noise ◽  
Low Noise Amplifier ◽  
Variable Gain ◽  
Equalization Technique ◽  
Frequency Selective ◽  
Noise Amplifier ◽  
Gain Equalization
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