Enhanced Interface Phonon Thermal Conductance via Boron Addition in Copper/Diamond Composites
2007 ◽
Vol 40
(22)
◽
pp. 7159-7165
◽
2009 ◽
Vol 373
(5)
◽
pp. 563-569
◽
2020 ◽
Vol 8
(23)
◽
pp. 11884-11891
◽
Keyword(s):
2007 ◽
Vol 92
◽
pp. 012082
◽
2013 ◽
Vol 31
(4)
◽
pp. 04D104
◽
2008 ◽
Vol 151
(1-2)
◽
pp. 234-238
◽