scholarly journals Influence of Conventional Versus Digital Workflow on Marginal Fit and Fracture Resistance of Different Pressable Occlusal Veneers After Thermomechanical Fatigue Loading

2021 ◽  
Vol 67 (1) ◽  
pp. 597-613
Author(s):  
Shereen Elsayed ◽  
Reham Elbasty
Keyword(s):  
Fracture Resistance ◽  
Fatigue Loading ◽  
Thermomechanical Fatigue ◽  
Digital Workflow ◽  
Marginal Fit

scholarly journals Impact of Thermomechanical Fatigue on Microstructure Evolution of a Ferritic-Martensitic 9 Cr and a Ferritic, Stainless 22 Cr Steel

2020 ◽  
Vol 10 (18) ◽  
pp. 6338 ◽  
Author(s):  
Bernd Kuhn ◽  
Jennifer Lopez Barrilao ◽  
Torsten Fischer
Keyword(s):  
Material Selection ◽  
Fatigue Loading ◽  
Thermomechanical Fatigue ◽  
Power Engineering ◽  
Microstructural Stability ◽  
Damage And Failure ◽  
Trade Name ◽  
Energy Conversion Systems ◽  
Grade 91 ◽  
Grade 91 Steel

The highly flexible operation schemes of future thermal energy conversion systems (concentrating solar power, heat storage and backup plants, power-2-X technologies) necessitate increased damage tolerance and durability of the applied structural materials under cyclic loading. Resistance to fatigue, especially thermomechanical fatigue and the associated implications for material selection, lifetime and its assessment, are issues not considered adequately by the power engineering materials community yet. This paper investigates the principal microstructural evolution, damage and failure of two steels in thermomechanical fatigue loading: Ferritic-martensitic grade 91 steel, a state of the art 9 wt % Cr power engineering grade and the 22 wt % Cr, ferritic, stainless Crofer® 22 H (trade name of VDM Metals GmbH, Germany; under license of Forschungszentrum Juelich GmbH) steel. While the ferritic-martensitic grade 91 steel suffers pronounced microstructural instability, the ferritic Crofer® 22 H provides superior microstructural stability and offers increased fatigue lifetime and more forgiving failure characteristics, because of innovative stabilization by (thermomechanically triggered) precipitation of fine Laves phase particles. The potential for further development of this mechanism of strengthening against fatigue is addressed.

Adhesion and Reliability of Polymer/Inorganic Interfaces

1998 ◽  
Vol 120 (4) ◽  
pp. 328-335 ◽  
Author(s):  
S.-Y. Kook ◽  
J. M. Snodgrass ◽  
A. Kirtikar ◽  
R. H. Dauskardt
Keyword(s):  
Fracture Resistance ◽  
Strain Energy Release ◽  
Interfacial Fracture ◽  
Fatigue Loading ◽  
Cyclic Fatigue ◽  
Interface Fracture ◽  
Fracture Toughness Test ◽  
Adhesion Promoter ◽  
Polymer Metal ◽  
Microelectronic Components

The reliability of microelectronic components is profoundly influenced by the interfacial fracture resistance (adhesion) and associated progressive debonding behavior. In this study we examine the interfacial fracture properties of representative polymer interfaces commonly found in microelectronic applications. Specifically, interface fracture mechanics techniques are described to characterize adhesion and progressive bebonding behavior of a polymer/metal interface under monotonic and cyclic fatigue loading conditions. Cyclic fatigue debond-growth rates were measured from ~10−11 to 10−6 m/cycle and found to display a power–law dependence on the applied strain energy release rate range, ΔG. Fracture toughness test results show that the interfaces typically exhibit resistance-curve behavior, with a plateau interface fracture resistance, Gss, strongly dependent on the interface morphology and the thickness of the polymer layer. The effect of a chemical adhesion promoter on the fracture energy of a polymer/silicon interface was also characterized. Micromechanisms controlling interfacial adhesion and progressive debonding are discussed in terms of the prevailing deformation mechanisms and related to interface structure and morphology.

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