scholarly journals Research and Development of Residual Life Prediction Technique for High Temperature Structural Materials

1987 ◽  
Vol 73 (9) ◽  
pp. 1089-1095 ◽  
Author(s):  
Norio SHINYA
2012 ◽  
Vol 516-517 ◽  
pp. 1843-1847
Author(s):  
Yi Wei ◽  
Yan Cheng Liu ◽  
Yu Dong Liu ◽  
Chuan Wang

In this paper, TTSP is used to demonstrate that the aging characteristic quantity at high temperature accords with that at low temperature, and to predict the residual life of shipboard cable. The aging process of cable is described based on second order dynamic model. The method is proved effective by the experimental data, and provides theoretical bases for residual life of cable and cable anti-aging study under the influence of multi-factors.


2019 ◽  
Vol 5 (4) ◽  
pp. 1279-1293 ◽  
Author(s):  
Jiawei Liu ◽  
Qi Li ◽  
Ying Han ◽  
Guorui Zhang ◽  
Xiang Meng ◽  
...  

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