scholarly journals Evaluation System and Correlation Analysis for Determining the Performance of a Semiconductor Manufacturing System

2021 ◽  
Vol 1 (3) ◽  
pp. 218-231
Author(s):  
Qingyun Yu ◽  
Li Li ◽  
Hui Zhao ◽  
Ying Liu ◽  
Kuo-Yi Lin
2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Che-Jung Chang ◽  
Der-Chiang Li ◽  
Wen-Li Dai ◽  
Chien-Chih Chen

The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms. One way to aid in this process is to use a forecasting tool. However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained. One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling. This study thus uses the AGM(1,1) grey model to solve the problem of forecasting in the pilot run stage of the packaging process. The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.


2002 ◽  
Vol 2002.12 (0) ◽  
pp. 275-276
Author(s):  
Nobutada FUJII ◽  
Motohiro KOBAYASHI ◽  
Toshiyuki MAKITA ◽  
Itsuo HATONO ◽  
Kanji UEDA

2004 ◽  
Vol 2004.14 (0) ◽  
pp. 203-204
Author(s):  
Nobutada FUJII ◽  
Masaaki KOBAYASHI ◽  
Motohiro KOBAYASHI ◽  
Itsuo HATONO ◽  
Kanji UEDA

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