Methodologies of Research into Artifacts (22nd Report) : Self-organization of Semiconductor Manufacturing System Layout

2002 ◽  
Vol 2002.12 (0) ◽  
pp. 275-276
Author(s):  
Nobutada FUJII ◽  
Motohiro KOBAYASHI ◽  
Toshiyuki MAKITA ◽  
Itsuo HATONO ◽  
Kanji UEDA
Keyword(s):  
Semiconductor Manufacturing ◽  
Manufacturing System ◽  
Self Organization ◽  
System Layout

Self-Organization of Facility Layout in a Multi-Product Semiconductor Manufacturing System

2004 ◽  
Vol 2004.14 (0) ◽  
pp. 203-204
Author(s):  
Nobutada FUJII ◽  
Masaaki KOBAYASHI ◽  
Motohiro KOBAYASHI ◽  
Itsuo HATONO ◽  
Kanji UEDA
Keyword(s):  
Semiconductor Manufacturing ◽  
Manufacturing System ◽  
Facility Layout ◽  
Self Organization

scholarly journals Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Che-Jung Chang ◽  
Der-Chiang Li ◽  
Wen-Li Dai ◽  
Chien-Chih Chen
Keyword(s):  
Semiconductor Manufacturing ◽  
Manufacturing System ◽  
Grey System Theory ◽  
Grey Model ◽  
Grey System ◽  
Wafer Level ◽  
Short Term ◽  
Packaging Process ◽  
Wafer Level Packaging

The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms. One way to aid in this process is to use a forecasting tool. However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained. One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling. This study thus uses the AGM(1,1) grey model to solve the problem of forecasting in the pilot run stage of the packaging process. The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.

Research on Holonic Control Structure and System Layout for Re-Configurable Manufacturing System (RCMS)

2011 ◽  
Vol 474-476 ◽  
pp. 490-497
Author(s):  
Xi Qin Wen ◽  
Xi Jie Ding ◽  
Zhong Min Zhao ◽  
Zhi Yu Xie
Keyword(s):  
Manufacturing System ◽  
Control Structure ◽  
Design Method ◽  
Hierarchical Control ◽  
Centralized Control ◽  
Market Demand ◽  
Key Technology ◽  
Implementation Method ◽  
Function Module ◽  
System Layout

In order to make reconstruction of re-configurable manufacturing system (RCMS) more efficient and fast, a new design method for control structure and system layout is put forward. First, a holon control structure, such as centralized-control, hierarchical control, non-strictly hierarchical control, and distributed control, is introduced. Each function module of the control structure not only has relative independent character and also cooperation with other control structure. It may constitute the required structural according to the market demand at any time to realize re-configurable control goals. At last, the key technology and the implementation method involved in layout design of equipment and system layer are discussed.

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