System-Level RF Desense Characterization for Mobile Computer Applications

Author(s):  
Jaejin Lee ◽  
Hao-han Hsu
2019 ◽  
Vol 16 (1) ◽  
pp. 81-88
Author(s):  
Zhanat Kunapianovna Nurbekova ◽  
Gaukhar Islyamovna Aimicheva

Problem and goal. The article deals with the problem of formation of logical competence in the design of mobile applications for future teachers of informatics. From the position of the competence approach in the structure of logical competence in the design of mobile applications are allocated motivational, cognitive, activity, communicative, reflexive components. Special attention is paid to the criteria and levels of formation of logical competence of future teachers of informatics in the design of mobile applications. Methodology. To diagnose the degree of formation of logical competence in the design of mobile applications are three levels: reproductive, productive and creative. Results. Five criteria aimed at determining the degree of understanding and application of the logical-algebraic apparatus in the development of mobile applications, generating new knowledge based on the experience and the possibility of applying the experience in the professional field are formulated. The article provides an example of determining the degree of formation of logical competence for the design of mobile applications. Conclusion. Reproductive and productive levels demonstrate the ability of students to design mobile applications based on a ready-made template or instructions. Creative level is the highest level of formation of logical competence of the student, indicating the ability to create mobile applications at a professional level on the basis of experience.


2006 ◽  
Vol 16 (01) ◽  
pp. 301-313 ◽  
Author(s):  
THOMAS W. KENNY ◽  
KENNETH E. GOODSON ◽  
JUAN G. SANTIAGO ◽  
EVELYN WANG ◽  
JAE-MO KOO ◽  
...  

Recent trends in processor power for the next generation devices point clearly to significant increase in processor heat dissipation over the coming years. In the desktop system design space, the tendency has been to minimize system enclosure size while maximizing performance, which in turn leads to high power densities in future generation systems. The current thermal solutions used today consist of advanced heat sink designs and heat pipe designs with forced air cooling to cool high power processors. However, these techniques are already reaching their limits to handle high heat flux, and there is a strong need for development of more efficient cooling systems which are scalable to handle the high heat flux generated by the future products. To meet this challenge, there has been research in academia and in industry to explore alternative methods for extracting heat from high-density power sources in electronic systems. This talk will discuss the issues surrounding device cooling, from the transistor level to the system level, and describe system-level solutions being developed for desktop computer applications developed in our group at Stanford University.


Author(s):  
Paul Horst ◽  
August Dvorak ◽  
Calvin Wright

1998 ◽  
Author(s):  
Martin P. Charns ◽  
Victoria A. Parker ◽  
William H. Wubbenhorst
Keyword(s):  

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