13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Latest Publications

TOTAL DOCUMENTS

191

(FIVE YEARS 0)

H-INDEX

12

(FIVE YEARS 0)

Published By IEEE

9781424495337, 9781424495320

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal desorption/injection characterization of a microfabricated passive preconcentrator/injector for micro gas chromatography

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231523 ◽

2012 ◽

Author(s):

Jung Hwan Seo ◽

Katsuo Kurabayashi

Keyword(s):

Gas Chromatography ◽

Thermal Desorption

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13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231557 ◽

2012 ◽

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In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configuration

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231437 ◽

2012 ◽

Author(s):

Takashi Kodama ◽

Woosung Park ◽

Amy Marconnet ◽

Jaehoo Lee ◽

Mehdi Asheghi ◽

...

Keyword(s):

Thermal Conductivity ◽

Conductivity Measurement ◽

Thermal Conductivity Measurement ◽

Conductive Materials

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Corrosion risk management in IT facilities

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231451 ◽

2012 ◽

Author(s):

Levente J Klein ◽

Michael Schappert ◽

Hendrik F. Hamann

Keyword(s):

Risk Management ◽

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Thermal stress analysis and failure mechanisms for through silicon via array

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231431 ◽

2012 ◽

Author(s):

Chi-Wei Kuo ◽

Hung-Yin Tsai

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Failure Mechanisms ◽

Through Silicon Via ◽

Thermal Stress Analysis

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Thermo-mechanical analysis of a typical solar module: A parametric study

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231566 ◽

2012 ◽

Author(s):

Shiwani Thakur ◽

Abhijit Kaisare ◽

Sandeep Tonapi

Keyword(s):

Parametric Study ◽

Mechanical Analysis ◽

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Transient analysis based thermal characterization of die-die interfaces in 3D-ICs

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231583 ◽

2012 ◽

Author(s):

H. Oprins ◽

V. Cherman ◽

K. Rebibis ◽

K. Vermeersch ◽

C. Gerets ◽

...

Keyword(s):

Transient Analysis ◽

Thermal Characterization ◽

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The affect of device level modeling on system-level thermal predictions

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231436 ◽

2012 ◽

Author(s):

Jens Weyant ◽

Daniel Reist ◽

Scott Garner

Keyword(s):

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Effect of copper surface roughness on thermal conductance of copper/carbon nanotube array interface

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231407 ◽

2012 ◽

Author(s):

Rong-Shiuan Chu ◽

Yang Zhao ◽

Costas P. Grigoropoulos

Keyword(s):

Surface Roughness ◽

Carbon Nanotube ◽

Thermal Conductance ◽

Copper Surface ◽

Nanotube Array ◽

Carbon Nanotube Array ◽

Effect Of Copper

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Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231482 ◽

2012 ◽

Author(s):

Amirkoushyar Ziabari ◽

Ali Shakouri

Keyword(s):

Integrated Circuits ◽

3D Ics ◽

Thermal Simulations

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