2007 8th International Conference on Electronic Packaging Technology
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209
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Published By IEEE

9781424413911, 9781424413928
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effect of Under Bump Metallization (UBM) Quality on Long Term Reliability

2007 ◽  
Author(s):  
Richard Rao ◽  
Mike Seabock ◽  
Tong Fang ◽  
Roy Carew
Keyword(s):  
Under Bump Metallization

Image Inspecting System of Positioning Accuracy of the Die Bonder

2007 ◽  
Author(s):  
Xiangxiu Huang ◽  
Ketian Li ◽  
Ji'an Liu ◽  
Jian-qi Liu ◽  
Ji-zhao Weng
Keyword(s):  
Positioning Accuracy

Advanced Packaging Technologies for Automotive Electronics

2007 ◽  
Author(s):  
Man-Lung Sham ◽  
Ziyang Gao ◽  
Lydia Lap-Wai Leung ◽  
Yu-Chih Chen ◽  
Tom Chung
Keyword(s):  
Automotive Electronics ◽  
Advanced Packaging

The Effect of Aging on Microstructures Evolution and Shear Behaviors in Lead-free Solder Joint

2007 ◽  
Author(s):  
Minghui Yang ◽  
Fangjuan Qi ◽  
Yaping Ding ◽  
Deliang Ren ◽  
Changling Xu
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Shear Behaviors
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