scholarly journals Negative Pattern Formation in Positive Resist Layer by EB / UV Hybrid Lithography

2016 ◽  
Vol 29 (4) ◽  
pp. 603-606
Author(s):  
Hiroki Nakano ◽  
Kenta Takahashi ◽  
Akira Kawai
Author(s):  
L. D. Jackel

Most production electron beam lithography systems can pattern minimum features a few tenths of a micron across. Linewidth in these systems is usually limited by the quality of the exposing beam and by electron scattering in the resist and substrate. By using a smaller spot along with exposure techniques that minimize scattering and its effects, laboratory e-beam lithography systems can now make features hundredths of a micron wide on standard substrate material. This talk will outline sane of these high- resolution e-beam lithography techniques.We first consider parameters of the exposure process that limit resolution in organic resists. For concreteness suppose that we have a “positive” resist in which exposing electrons break bonds in the resist molecules thus increasing the exposed resist's solubility in a developer. Ihe attainable resolution is obviously limited by the overall width of the exposing beam, but the spatial distribution of the beam intensity, the beam “profile” , also contributes to the resolution. Depending on the local electron dose, more or less resist bonds are broken resulting in slower or faster dissolution in the developer.


1993 ◽  
Vol 3 (6) ◽  
pp. 865-889 ◽  
Author(s):  
Norbert Schwenk ◽  
Hans Wolfgang Spiess
Keyword(s):  

2000 ◽  
Vol 629 ◽  
Author(s):  
Jean-Loup Masson ◽  
Peter F. Green

ABSTRACTResearchers have shown that thin, nonwetting, liquid homopolymer films dewet substrates, forming patterns that reflect fluctuations in the local film thickness. These patterns have been shown to be either discrete cylindrical holes or bicontinuous “spinodal-like” patterns. In this paper we show the existence of a new morphology. During the early stage of dewetting, discrete highly asymmetric holes appear spontaneously throughout the film. The nucleation rate of these holes is faster than their growth rate. The morphology of the late stage of evolution, after 18 days, is characterized by a bicontinuous pattern, distinct form conventional spinodal dewetting patterns. This morphology has been observed for a range of film thicknesses between 7.5 and 21nm. The structural evolution of this intermediate morphology is discussed.


Author(s):  
Daniel Coelho ◽  
José da Rocha Miranda Pontes ◽  
Norberto Mangiavacchi
Keyword(s):  

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