Forced convection cooling of heat generating blocks simulating electronic components

1992 ◽  
Author(s):  
WON CHANG ◽  
JEFFREY BROWN ◽  
JONG JANG
Keyword(s):  
Forced Convection ◽  
Electronic Components ◽  
Convection Cooling

An Invariant Descriptor for the Conjugate Cooling of Discrete Heaters in a Duct

2013 ◽  
Author(s):  
Bruna R. Loiola ◽  
Carlos A. C. Altemani
Keyword(s):  
Forced Convection ◽  
Power Dissipation ◽  
Circuit Boards ◽  
Rectangular Duct ◽  
Electronic Components ◽  
Cfd Simulations ◽  
Arbitrary Power ◽  
Heat Spreaders ◽  
Convection Cooling ◽  
Conduction Cooling

Forced convection cooling of electronic components mounted on circuit boards may be conveniently enhanced by conductive boards because they act as heat spreaders for the components’ cooling. This gives rise to a conjugate forced convection-conduction cooling of discrete components mounted on a board. An experimental investigation was performed to show that the temperatures of two thermal mockups mounted on the lower conductive wall of a rectangular duct cooled by forced airflow may be conveniently predicted by means of dimensionless conjugate coefficients g+ij. They are invariant with the heaters power dissipation and they may be grouped in a square matrix G+. The results were expressed as functions of the airflow Reynolds number, based on the duct hydraulic diameter, in the range from 1,600 to 6,500. The conjugate coefficients were conveniently obtained from tests with a single active heater at a time. Additional tests showed that for arbitrary power dissipation in both heaters, their temperatures were well predicted by the invariant conjugate coefficients. Numerical CFD simulations were also performed for conditions similar to those of the tests and the results were compared to those of the experiments.

A COMPUTATIONAL MODEL FOR FORCED CONVECTION COOLING IN ELECTRONIC COMPONENTS

1995 ◽  
Vol 05 (03) ◽  
pp. 183-192 ◽  
Author(s):  
T. OLIVOS ◽  
P. MAJUMDAR
Keyword(s):  
Computational Model ◽  
Forced Convection ◽  
Electronic Components ◽  
Convection Cooling

Cooling characteristics on the forced convection of an array of flat-form electronic components in channel flow

1998 ◽  
Vol 12 (1) ◽  
pp. 132-142 ◽  
Author(s):  
Kwang Soo Kim ◽  
Won Tae Kim ◽  
Ki Baik Lee
Keyword(s):  
Forced Convection ◽  
Channel Flow ◽  
Electronic Components

scholarly journals The use of fractional calculus for the optimal placement of electronic components on a linear array

2015 ◽  
Vol 28 (1) ◽  
pp. 77-84
Author(s):  
Mey de ◽  
Mariusz Felczak ◽  
Bogusław Więcek
Keyword(s):  
Integral Equation ◽  
Fractional Calculus ◽  
Forced Convection ◽  
Linear Array ◽  
The Other ◽  
Simple Solution ◽  
Optimal Placement ◽  
Critical Component ◽  
Electronic Components ◽  
One Dimensional

Cooling of heat dissipating components has become an important topic in the last decades. Sometimes a simple solution is possible, such as placing the critical component closer to the fan outlet. On the other hand this component will heat the air which has to cool the other components further away from the fan outlet. If a substrate bearing a one dimensional array of heat dissipating components, is cooled by forced convection only, an integral equation relating temperature and power is obtained. The forced convection will be modelled by a simple analytical wake function. It will be demonstrated that the integral equation can be solved analytically using fractional calculus.

Improvement of Forced Convection Cooling Due to the Attachment of Heat Sources to a Conducting Thick Plate

2013 ◽  
Vol 135 (12) ◽  
Author(s):  
Mohammad Reza Hajmohammadi ◽  
Antonio Campo ◽  
S. Salman Nourazar ◽  
Amir Masood Ostad
Keyword(s):  
Forced Convection ◽  
Thick Plate ◽  
Plate Thickness ◽  
Heat Current ◽  
Heat Sources ◽  
Excess Temperature ◽  
Optimal Thickness ◽  
Numerical Work ◽  
Flowing Fluid ◽  
Convection Cooling

It is proposed that a conductive thick plate is placed between a heat source and a cold flowing fluid to improve the forced convection cooling performance. Detailed numerical work is carried out to determine the optimal thickness of the conductive thick plate which minimizes the peak temperature. It is shown that the thick plate significantly reduces the excess temperature of heat sources, by way of conducting the heat current in an optimal manner. It is shown that the reduction in the excess temperature of heat sources depends upon the Reynolds number of the fluid flow and the material thermal conductivity. Correlations for the optimum plate thickness and reduction in excess temperature of heat sources are presented, which could be useful for the practitioners.

Study of the optimal layout of cooling fins in forced convection cooling

2002 ◽  
Vol 42 (7) ◽  
pp. 1101-1111 ◽  
Author(s):  
Octavio Leon ◽  
Gilbert De Mey ◽  
Erik Dick
Keyword(s):  
Forced Convection ◽  
Optimal Layout ◽  
Convection Cooling
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