Cooling characteristics on the forced convection of an array of flat-form electronic components in channel flow

1998 ◽  
Vol 12 (1) ◽  
pp. 132-142 ◽  
Author(s):  
Kwang Soo Kim ◽  
Won Tae Kim ◽  
Ki Baik Lee
Keyword(s):  
Forced Convection ◽  
Channel Flow ◽  
Electronic Components

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks

2005 ◽  
Author(s):  
Tohru Suwa ◽  
Hamid Hadim
Keyword(s):  
Neural Networks ◽  
Heat Flux ◽  
Artificial Neural Networks ◽  
Forced Convection ◽  
Channel Flow ◽  
Superposition Method ◽  
Electronic Components ◽  
Printed Circuit ◽  
Placement Optimization ◽  
Optimization Methodology

A multidisciplinary placement optimization methodology for heat generating electronic components on printed circuit boards (PCBs) in channel flow forced convection is presented. In this methodology, thermal, electrical, and placement criteria involving junction temperature, wiring density, line length for high frequency signals, and critical component location are optimized simultaneously using the genetic algorithm. A board-level thermal performance prediction methodology based on channel flow forced convection boundary conditions is developed. The methodology consists of a combination of artificial neural networks (ANNs) and a superposition method that is able to predict PCB surface and component junction temperatures in a much shorter calculation time than the existing numerical methods. Three ANNs are used for predicting temperature rise at the PCB surface caused by a single heat flux at an arbitrary location on the board, while temperature rise due to multiple heat flux is calculated using a superposition method. Compact thermal models are used for the electronic components thermal modeling. Using this optimization methodology, large calculation time reduction is achieved without losing accuracy. For thermal model validation, the present thermal methodology predicts junction temperatures with maximum error of 1.8°C comparing to the conjugate solid/ fluid heat transfer analysis result. The present thermal modeling takes 12 seconds, while the conjugate analysis takes 30 hours for the validation on the same computer. To demonstrate the capabilities of the present methodology, a test case of component placement on a PCB is presented.

FORCED CONVECTION 3 (Channel Flow)

1970 ◽  
Author(s):  
V. Walker
Keyword(s):  
Forced Convection ◽  
Channel Flow

scholarly journals The use of fractional calculus for the optimal placement of electronic components on a linear array

2015 ◽  
Vol 28 (1) ◽  
pp. 77-84
Author(s):  
Mey de ◽  
Mariusz Felczak ◽  
Bogusław Więcek
Keyword(s):  
Integral Equation ◽  
Fractional Calculus ◽  
Forced Convection ◽  
Linear Array ◽  
The Other ◽  
Simple Solution ◽  
Optimal Placement ◽  
Critical Component ◽  
Electronic Components ◽  
One Dimensional

Cooling of heat dissipating components has become an important topic in the last decades. Sometimes a simple solution is possible, such as placing the critical component closer to the fan outlet. On the other hand this component will heat the air which has to cool the other components further away from the fan outlet. If a substrate bearing a one dimensional array of heat dissipating components, is cooled by forced convection only, an integral equation relating temperature and power is obtained. The forced convection will be modelled by a simple analytical wake function. It will be demonstrated that the integral equation can be solved analytically using fractional calculus.

Application of Different Conductive Substrate Materials for Heat Transfer Enhancement in Cooling of Electronic Components

2014 ◽  
Vol 1082 ◽  
pp. 327-331
Author(s):  
Thiago Antonini Alves ◽  
Murilo A. Barbur ◽  
Felipe Baptista Nishida
Keyword(s):  
Heat Transfer ◽  
Fluid Flow ◽  
Heat Transfer Enhancement ◽  
Forced Convection ◽  
Pure Aluminum ◽  
Rectangular Channel ◽  
Electronic Components ◽  
Transfer Enhancement ◽  
Cooling Process ◽  
Conductive Substrate

In this research, a study of the heat transfer enhancement in electronic components mounted in channels was conducted by using different materials in the conductive substrate. In this context, a numerical analysis was performed to investigate the cooling of 3D protruding heaters mounted on the bottom wall (substrate) of a horizontal rectangular channel using the ANSYS/FluentTM 15.0 software. Three different materials of the conductive substrate were analyzed, polymethyl methacrylate (PMMA), fiberglass reinforced epoxy laminate (FR4), and pure aluminum (Al). Uniform heat generation rate was considered for the protruding heaters and the cooling process happened through a steady laminar airflow, with constant properties. The fluid flow velocity and temperature profiles were uniform at the channel entrance. For the adiabatic substrate, the cooling process occurred exclusively by forced convection. For the conductive substrate, the cooling process was characterized by conjugate forced convection-conduction heat transfer through two mechanisms; one directly between the heaters surfaces and the flow by forced convection, and the other through conduction at the interfaces heater-substrate in addition to forced convection from the substrate to the fluid flow at the substrate surface. The governing equations and boundary conditions were numerically solved through a coupled procedure using the Control Volumes Method in a single domain comprising the solid and fluid regions. Commonly used properties in cooling of electronics components mounted in a PCB and typical geometry dimensions were utilized in the results acquisition. Some examples were presented, indicating the dependence of the substrate thermal conductivity related to the Reynolds number on the heat transfer enhancement. Thus, resulting in a lower work temperature at the electronic components.

Thermal Equilibrium in Transient Forced Convection Porous Channel Flow

2004 ◽  
Vol 57 (1) ◽  
pp. 49-58 ◽  
Author(s):  
B. A. Abu-Hijleh ◽  
M. A. Al-Nimr ◽  
M. A. Hader
Keyword(s):  
Forced Convection ◽  
Channel Flow ◽  
Thermal Equilibrium ◽  
Porous Channel

THERMAL INTERACTION BETWEEN ISOLATED HEATED ELECTRONIC COMPONENTS IN PULSATING CHANNEL FLOW

1998 ◽  
Vol 34 (1) ◽  
pp. 1-21 ◽  
Author(s):  
Seo Young Kim ◽  
Byung Ha Kang ◽  
Yogesh Jaluria
Keyword(s):  
Channel Flow ◽  
Thermal Interaction ◽  
Electronic Components

Forced convection cooling of heat generating blocks simulating electronic components

1992 ◽  
Author(s):  
WON CHANG ◽  
JEFFREY BROWN ◽  
JONG JANG
Keyword(s):  
Forced Convection ◽  
Electronic Components ◽  
Convection Cooling
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