Moisture Expansion of Structural Ceramics: A Spanish Experience

2021 ◽  
Vol 3 (2) ◽  
pp. 49-51
Author(s):  
Eduardo Gomez Lopez ◽  
Federico De Isidro Gordejuela ◽  
Carlos Machin Hamalainen
Author(s):  
S.X. Li ◽  
K. Lee ◽  
J. Hulog ◽  
R. Gannamani ◽  
S. Yin

Abstract Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.


2010 ◽  
Vol 133-134 ◽  
pp. 201-204
Author(s):  
Ibrahim Mohamad H. Wan ◽  
B.H. Abu Bakar ◽  
M.A. Megat Johari ◽  
P.J. Ramadhansyah

This paper presents the behaviour of moisture movement of calcium silicate brick masonry walls exposed to sodium sulphate environment. The walls were exposed to three sodium sulphate conditions with sulphate concentrations of5%, 10% and 15%. For comparison, some walls were also exposed to dry and wet condition which acts as a control conditions. All specimens were prepared and cured under polythene sheet for 14 days in a controlled environmental room and maintained at relative humidity and temperature of 80 ± 5% and 25 ± 2°C, respectively. After the curing period, the specimens were exposed to sodium sulphate as well as drying and water exposures, during which moisture movement was measured and monitored for a period of up to 7 months. As a result, the moisture expansion was observed and recorded for all masonry wall specimens after exposed to the sulphate condition.


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