STUDY ON WELDING SHRINKAGE AND DETERMINING OPTIMUM OPENING UNDER BACKING PLATE IN THE APPLICATION OF COLUMN-FIELD-WELDING ROBOT

Author(s):  
Kiwamu NISITA
Keyword(s):  
Author(s):  
J. E. O'Neal ◽  
J. J. Bellina ◽  
B. B. Rath

Thin films of the bcc metals vanadium, niobium and tantalum were epitaxially grown on (0001) and sapphire substrates. Prior to deposition, the mechanical polishing damage on the substrates was removed by an in-situ etch. The metal films were deposited by electron-beam evaporation in ultra-high vacuum. The substrates were heated by thermal contact with an electron-bombarded backing plate. The deposition parameters are summarized in Table 1.The films were replicated and examined by electron microscopy and their crystallographic orientation and texture were determined by reflection electron diffraction. Verneuil-grown and Czochralskigrown sapphire substrates of both orientations were employed for each evaporation. The orientation of the metal deposit was not affected by either increasing the density of sub-grain boundaries by about a factor of ten or decreasing the deposition rate by a factor of two. The results on growth epitaxy are summarized in Tables 2 and 3.


ROBOT ◽  
2013 ◽  
Vol 35 (1) ◽  
pp. 90 ◽  
Author(s):  
Haiyong CHEN ◽  
Zaojun FANG ◽  
De XU ◽  
Hexu SUN

2016 ◽  
Vol 85 (7) ◽  
pp. 646-651
Author(s):  
Teruki ITO

2010 ◽  
Vol 15 (4) ◽  
pp. 374-385 ◽  
Author(s):  
Namkug Ku ◽  
Ju-hwan Cha ◽  
Kyu-Yeul Lee ◽  
Jongwon Kim ◽  
Tae-wan Kim ◽  
...  

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