Change of Chemical Bonding State at Interface between Cu Thin Film and Polyimide Substrate after Heat Treatment.
1996 ◽
Vol 39
(1)
◽
pp. 7-10
◽
Satoru IWAMORI
◽
Takehiro MIYASHITA
◽
Shin FUKUDA
◽
Nobuhiro FUKUDA
◽
Kazufuyu SUDOH
1996 ◽
Vol 39
(2)
◽
pp. 65-70
◽
Satoru IWAMORI
◽
Takehiro MIYASHITA
◽
Shin FUKUDA
◽
Nobuhiro FUKUDA
◽
Kazufuyu SUDOH
Jianbo Liang
◽
Ayaka Kobayashi
◽
Yasuo Shimizu
◽
Yutaka Ohno
◽
Seong‐Woo Kim
◽
...
1996 ◽
Vol 39
(3)
◽
pp. 103-110
◽
Satoru IWAMORI
◽
Takehiro MIYASHITA
◽
Shin FUKUDA
◽
Nobuhiro FUKUDA
◽
Kazufuyu SUDOH
2000 ◽
Vol 77
(17)
◽
pp. 2653-2655
◽
Yasuji Muramatsu
◽
Hisataka Takenaka
◽
Yuko Ueno
◽
Eric M. Gullikson
◽
Rupert C. C. Perera
1998 ◽
Vol 106
(1230)
◽
pp. 150-154
◽
Taro ASAHI
◽
Takayuki INO
◽
Yoshinari MIURA
◽
Tokuro NANBA
◽
Hiroshi YAMASHITA
Tokuro Nanba
◽
Tatsuya Hagiwara
◽
Yoshinari Miura
2019 ◽
Vol 41
(3)
◽
pp. 265-272
Koji Yamashita
◽
Arata Komatsu
◽
Masato Watanabe
◽
Yuuya Numajiri
◽
Darius Zade
◽
...
1999 ◽
Vol 79
(6)
◽
pp. 327-331
◽
T. Yamamoto
◽
K. Hayashi
◽
Y. Ikuhara
◽
T. Sakuma
1997 ◽
Vol 15
(1)
◽
pp. 53
◽