scholarly journals Change of Chemical Bonding State at Interface between Cu Thin Film and Polyimide Substrate after Heat Treatment.

Shinku ◽  
1996 ◽  
Vol 39 (1) ◽  
pp. 7-10 ◽  
Author(s):  
Satoru IWAMORI ◽  
Takehiro MIYASHITA ◽  
Shin FUKUDA ◽  
Nobuhiro FUKUDA ◽  
Kazufuyu SUDOH
Shinku ◽  
1996 ◽  
Vol 39 (2) ◽  
pp. 65-70 ◽  
Author(s):  
Satoru IWAMORI ◽  
Takehiro MIYASHITA ◽  
Shin FUKUDA ◽  
Nobuhiro FUKUDA ◽  
Kazufuyu SUDOH

2021 ◽  
pp. 2104564
Author(s):  
Jianbo Liang ◽  
Ayaka Kobayashi ◽  
Yasuo Shimizu ◽  
Yutaka Ohno ◽  
Seong‐Woo Kim ◽  
...  

Shinku ◽  
1996 ◽  
Vol 39 (3) ◽  
pp. 103-110 ◽  
Author(s):  
Satoru IWAMORI ◽  
Takehiro MIYASHITA ◽  
Shin FUKUDA ◽  
Nobuhiro FUKUDA ◽  
Kazufuyu SUDOH

2000 ◽  
Vol 77 (17) ◽  
pp. 2653-2655 ◽  
Author(s):  
Yasuji Muramatsu ◽  
Hisataka Takenaka ◽  
Yuko Ueno ◽  
Eric M. Gullikson ◽  
Rupert C. C. Perera

1998 ◽  
Vol 106 (1230) ◽  
pp. 150-154 ◽  
Author(s):  
Taro ASAHI ◽  
Takayuki INO ◽  
Yoshinari MIURA ◽  
Tokuro NANBA ◽  
Hiroshi YAMASHITA

2019 ◽  
Vol 41 (3) ◽  
pp. 265-272
Author(s):  
Koji Yamashita ◽  
Arata Komatsu ◽  
Masato Watanabe ◽  
Yuuya Numajiri ◽  
Darius Zade ◽  
...  

1999 ◽  
Vol 79 (6) ◽  
pp. 327-331 ◽  
Author(s):  
T. Yamamoto ◽  
K. Hayashi ◽  
Y. Ikuhara ◽  
T. Sakuma

Sign in / Sign up

Export Citation Format

Share Document