scholarly journals Solid Fraction Determination at the Rigidity Point by Advanced Thermal Analysis

2021 ◽  
Vol 12 (1) ◽  
pp. 237
Author(s):  
Ester Villanueva ◽  
Iban Vicario ◽  
Jon Mikel Sánchez ◽  
Joseba Albizuri ◽  
Jessica Montero
Keyword(s):  
Thermal Analysis ◽  
Solid Fraction ◽  
Alloy Composition ◽  
Correlation Factor ◽  
Solidification Behavior ◽  
Analysis Techniques ◽  
Calculating Method ◽  
Taguchi Design Of Experiments ◽  
Thermal Analysis Techniques ◽  
Fraction Determination

The aim of this work is to determine the Solid Fraction (SF) at the rigidity point (FRP) by applying advanced thermal analysis techniques. The variation of the FRP value is important to explain the solidification behavior and the presence or absence of defects in aluminum alloys. As the final alloy composition plays a key role on obtained properties, the influence of major and minor alloying elements on FRP has been studied. A Taguchi design of experiments and a previously developed calculating method, based on the application of high rank derivatives has been employed to determinate first the rigidity point temperature (RPT) and after the corresponding FRP for AlSi10Mg alloys. A correlation factor of r2 of 0.81 was obtained for FRP calculation formula in function of the alloy composition.

Crystal/Glass Phase Change in KSb5S8Studied through Thermal Analysis Techniques

2004 ◽  
Vol 16 (10) ◽  
pp. 1932-1937 ◽  
Author(s):  
K. Chrissafis ◽  
Theodora Kyratsi ◽  
K. M. Paraskevopoulos ◽  
Mercouri G. Kanatzidis
Keyword(s):  
Thermal Analysis ◽  
Phase Change ◽  
Glass Phase ◽  
Crystal Glass ◽  
Analysis Techniques ◽  
Thermal Analysis Techniques

scholarly journals Characterization of poled and non-poled β-PVDF films using thermal analysis techniques

2004 ◽  
Vol 424 (1-2) ◽  
pp. 201-207 ◽  
Author(s):  
V. Sencadas ◽  
S. Lanceros-Méndez ◽  
J.F. Mano
Keyword(s):  
Thermal Analysis ◽  
Analysis Techniques ◽  
Thermal Analysis Techniques

Can We Trust on the Thermal Analysis of Metal Organic Powders for thin film preparation?

2012 ◽  
Vol 1449 ◽  
Author(s):  
Jordi Farjas ◽  
Daniel Sanchez-Rodriguez ◽  
Hichem Eloussifi ◽  
Raul Cruz Hidalgo ◽  
Pere Roura ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Analysis ◽  
Thermal Analyses ◽  
Heat And Mass Transport ◽  
Analysis Techniques ◽  
Thin Film Preparation ◽  
Metal Organic ◽  
Organic Precursors ◽  
Film Preparation ◽  
Thermal Analysis Techniques

ABSTRACTThermal analysis techniques are routinely applied to characterize the thermal behavior of metal organic precursors used for oxide film preparation. Since the mass of films is very low, researchers do their thermal analyses on powders and consider that the results are representative of films. We will show here that, in general, this assumption is not true. Several examples involving precursors of YBa2Cu3O7-x (Ba and Y trifluoroacetates and Ba propionate) will serve to appreciate that films can behave very differently than powders due to their enhanced heat and mass transport paths. Ultimately, we will demonstrate that, in some cases, relying on powders thermal analysis may lead to erroneous conclusions.

scholarly journals Heat transfer simulation of the cure of thermoplastic particle interleaf carbon fibre epoxy prepregs

2018 ◽  
Vol 53 (15) ◽  
pp. 2053-2064 ◽  
Author(s):  
Tassos Mesogitis ◽  
James Kratz ◽  
Alex A Skordos
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Sensitivity Study ◽  
Process Models ◽  
Analysis Techniques ◽  
New Class ◽  
Thermosetting Polymers ◽  
Heat Transfer Simulation ◽  
Thermal Analysis Techniques ◽  
Semi Empirical

Thermochemical properties are needed to develop process models and define suitable cure cycles to convert thermosetting polymers into rigid glassy materials. Uncertainty surrounding the suitability of thermal analysis techniques and semi-empirical models developed for conventional composite materials has been raised for the new class of particle interleaf materials. This paper describes kinetics, conductivity, heat capacity and glass transition temperature measurements of HexPly® M21 particle interleaf material. Thermal models describing conventional, non-particle epoxy systems were fit to the data and validated through a thick-section cure. Results from curing experiments agree with heat transfer simulation predictions, indicating that established thermal analysis techniques and models can describe polymerisation and evolving material properties during processing of a material representing the class of interleaf toughened systems. A sensitivity study showed time savings up to about 20%, and associated energy-efficiency-productivity benefits can be achieved by using cure simulation for particle interleaf materials.

Characterization of Sol Gel Prepared KTN Thin Films and Powders by Raman, XRD, and Thermal Analysis Techniques.

2002 ◽  
Vol 718 ◽  
Author(s):  
A.A. Savvinov ◽  
S.B. Majumder ◽  
R.S. Katiyar
Keyword(s):  
Thin Films ◽  
Thermal Analysis ◽  
Sol Gel ◽  
Dynamic Effect ◽  
Orthorhombic Phase ◽  
Analysis Techniques ◽  
Perovskite Materials ◽  
Wide Range ◽  
Thermal Analysis Techniques ◽  
And Inversion

AbstractThe renewed interest in KTa1-xNbxO (KTN) mixed perovskite materials is connected with their remarkable dielectric properties in the dilute compositions. KTN thin films with x = 0.35 have been prepared on different substrates by sol-gel technique as well as a set of powders with x = 0, 0.05, 0.1, 0.25, 0.48, 0.65, 0.75, and 1. Properties of the material change drastically with the change of x, because of relaxation of both translational and inversion symmetry due to a static disorder in the Nb distribution and the dynamic effect of a precursor ferroelectric order above Tc. Special attention was paid to the characteristic feature of coupling of the single-phonon state to a two-acoustic-phonon feature through anharmonic terms in the potential function as well as behavior of the TO3 mode which becomes a narrow peak of the first-order scattering in the tetragonal ferroelectric phase and shows a tendency to split below Tc2 in the orthorhombic phase. The wide range of x allows better understanding of dynamic processes in the KTN bulk materials which in turn helps in the studies of thin films. The above mentioned materials were studied using Raman scattering, XRD, and thermal analysis techniques.

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