In situ SEM observation and interface adhesion strength analysis of a serpentine interconnect on a flexible electronic composite film

2020 ◽  
Vol 14 (1) ◽  
pp. 017002
Author(s):  
Cheng Chen ◽  
Rui Chen ◽  
Wanghang Gu ◽  
Bing Liu ◽  
Hongwei Ji
Keyword(s):  
Composite Film ◽  
Adhesion Strength ◽  
Strength Analysis ◽  
Interface Adhesion ◽  
Sem Observation ◽  
Flexible Electronic

scholarly journals In-situ FE-SEM observation of the growth behaviors of Fe particles at magmatic temperatures

2021 ◽  
Vol 560-561 ◽  
pp. 126043
Author(s):  
Mayumi Mujin ◽  
Michihiko Nakamura ◽  
Megumi Matsumoto
Keyword(s):  
Sem Observation

scholarly journals Intercellular Adhesion Strength Analysis Utilizing Femtosecond Laser Impulse

2017 ◽  
Vol 57 (2) ◽  
pp. 107-110
Author(s):  
Yoichiroh HOSOKAWA ◽  
Takanori IINO ◽  
Man HAGIYAMA ◽  
Akihiko ITO
Keyword(s):  
Femtosecond Laser ◽  
Adhesion Strength ◽  
Intercellular Adhesion ◽  
Strength Analysis ◽  
Laser Impulse

Investigation of the adhesion strength and deformation behaviour of in situ fabricated NbC coatings by scratch testing

2016 ◽  
Vol 299 ◽  
pp. 135-142 ◽  
Author(s):  
Xiaolong Cai ◽  
Yunhua Xu ◽  
Nana Zhao ◽  
Lisheng Zhong ◽  
Ziyuan Zhao ◽  
...  
Keyword(s):  
Adhesion Strength ◽  
Deformation Behaviour ◽  
Scratch Testing ◽  
Strength And Deformation

Effect of self-assembling WC film upon diamond on adhesion strength with Fe-Co-Ni binder: In situ TEM tensile tests

2022 ◽  
Vol 208 ◽  
pp. 114331
Author(s):  
P.A. Loginov ◽  
A.A. Zaitsev ◽  
D.A. Sidorenko ◽  
E.A. Levashov
Keyword(s):  
Adhesion Strength ◽  
Tensile Tests ◽  
In Situ Tem ◽  
Self Assembling

In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures

2002 ◽  
Vol 64 (1-4) ◽  
pp. 375-382 ◽  
Author(s):  
M.A Meyer ◽  
M Herrmann ◽  
E Langer ◽  
E Zschech
Keyword(s):  
Sem Observation ◽  
Copper Interconnect
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