scholarly journals A New Approach of Hetero-Cladding for Design of Compact Si Photonic Directional Coupler

2021 ◽  
Author(s):  
MADHUSUDAN MISHRA ◽  
Nikhil Das
Keyword(s):  
Integrated Circuits ◽  
Cross Section ◽  
Energy Efficient ◽  
Directional Coupler ◽  
Photonic Integrated Circuits ◽  
Phase Shifters ◽  
Evanescent Mode ◽  
Low Loss ◽  
New Approach ◽  
Silicon Photonic

In this letter, we propose a new approach of hetero-cladding for realization of compact CMOS compatible silicon photonic directional couplers. The proposed hetero-cladding comprises ferroelectric BaTiO<sub>3</sub> (BTO) and SiO<sub>2</sub> to control the evanescent mode within the structure. The results show very small and identical coupling length for both TE and TM modes with reduced device cross-section, which promises for a huge reduction in the footprint of both conventional and programmable photonic integrated circuits. The concept can also be utilized to design compact, low loss and energy efficient phase shifters, other types of couplers, sensors etc.

scholarly journals A New Approach of Hetero-Cladding for Design of Compact Si Photonic Directional Coupler

2021 ◽  
Author(s):  
MADHUSUDAN MISHRA ◽  
Nikhil Das
Keyword(s):  
Integrated Circuits ◽  
Cross Section ◽  
Energy Efficient ◽  
Directional Coupler ◽  
Photonic Integrated Circuits ◽  
Phase Shifters ◽  
Evanescent Mode ◽  
Low Loss ◽  
New Approach ◽  
Silicon Photonic

In this letter, we propose a new approach of hetero-cladding for realization of compact CMOS compatible silicon photonic directional couplers. The proposed hetero-cladding comprises ferroelectric BaTiO<sub>3</sub> (BTO) and SiO<sub>2</sub> to control the evanescent mode within the structure. The results show very small and identical coupling length for both TE and TM modes with reduced device cross-section, which promises for a huge reduction in the footprint of both conventional and programmable photonic integrated circuits. The concept can also be utilized to design compact, low loss and energy efficient phase shifters, other types of couplers, sensors etc.

scholarly journals A New Approach of Hetero-Cladding Using Ferroelectric BaTiO3 and SiO2 for Design of Compact Si Photonic Tunable Directional Coupler

2021 ◽  
Author(s):  
MADHUSUDAN MISHRA ◽  
Nikhil Das
Keyword(s):  
Integrated Circuits ◽  
Cross Section ◽  
Energy Efficient ◽  
Directional Coupler ◽  
Photonic Integrated Circuits ◽  
Phase Shifters ◽  
Evanescent Mode ◽  
Low Loss ◽  
New Approach ◽  
Silicon Photonic

<p><i>Abstract</i>— The present work proposes a new approach of hetero-cladding for silicon photonic directional couplers and outlines its contributions towards realization of a compact, tunable and energy efficient directional coupler. The proposed hetero-cladding comprises ferroelectric BaTiO<sub>3</sub> (BTO) and SiO<sub>2</sub>, to control the evanescent mode within the structure. The results show very small and identical coupling length for both TE and TM modes with reduced device cross-section, which promises for a huge reduction in the footprint of both conventional and programmable photonic integrated circuits (PICs). The proposed concept could also be utilized to design compact, low loss and energy efficient phase shifters and other types of couplers.</p>

scholarly journals A New Approach of Hetero-Cladding Using Ferroelectric BaTiO3 and SiO2 for Design of Compact Si Photonic Tunable Directional Coupler

2021 ◽  
Author(s):  
MADHUSUDAN MISHRA ◽  
Nikhil Das
Keyword(s):  
Integrated Circuits ◽  
Cross Section ◽  
Energy Efficient ◽  
Directional Coupler ◽  
Photonic Integrated Circuits ◽  
Phase Shifters ◽  
Evanescent Mode ◽  
Low Loss ◽  
New Approach ◽  
Silicon Photonic

<p><i>Abstract</i>— The present work proposes a new approach of hetero-cladding for silicon photonic directional couplers and outlines its contributions towards realization of a compact, tunable and energy efficient directional coupler. The proposed hetero-cladding comprises ferroelectric BaTiO<sub>3</sub> (BTO) and SiO<sub>2</sub>, to control the evanescent mode within the structure. The results show very small and identical coupling length for both TE and TM modes with reduced device cross-section, which promises for a huge reduction in the footprint of both conventional and programmable photonic integrated circuits (PICs). The proposed concept could also be utilized to design compact, low loss and energy efficient phase shifters and other types of couplers.</p>

scholarly journals Wafer-scale low-loss lithium niobate photonic integrated circuits

2020 ◽  
Author(s):  
Kevin Luke ◽  
Prashanta Kharel ◽  
Christian Reimer ◽  
Lingyan He ◽  
Marko Loncar ◽  
...  
Keyword(s):  
Lithium Niobate ◽  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Low Loss ◽  
Wafer Scale

Scalable Ultra-Wideband Pulse Generation Based on Silicon Photonic Integrated Circuits

2017 ◽  
Vol 29 (21) ◽  
pp. 1896-1899 ◽  
Author(s):  
Xinru Wu ◽  
Ke Xu ◽  
Wen Zhou ◽  
Chi Wai Chow ◽  
Hon Ki Tsang
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Pulse Generation ◽  
Ultra Wideband ◽  
Silicon Photonic

scholarly journals Long Low-Loss-Litium Niobate on Insulator Waveguides with Sub-Nanometer Surface Roughness

Nanomaterials ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 910 ◽  
Author(s):  
Rongbo Wu ◽  
Min Wang ◽  
Jian Xu ◽  
Jia Qi ◽  
Wei Chu ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Integrated Circuits ◽  
Large Scale ◽  
Photonic Integrated Circuits ◽  
Surface Patterning ◽  
Propagation Loss ◽  
Direct Writing ◽  
Laser Direct Writing ◽  
Low Loss ◽  
Atomic Force

In this paper, we develop a technique for realizing multi-centimeter-long lithium niobate on insulator (LNOI) waveguides with a propagation loss as low as 0.027 dB/cm. Our technique relies on patterning a chromium thin film coated on the top surface of LNOI into a hard mask with a femtosecond laser followed by chemo-mechanical polishing for structuring the LNOI into the waveguides. The surface roughness on the waveguides was determined with an atomic force microscope to be 0.452 nm. The approach is compatible with other surface patterning technologies, such as optical and electron beam lithographies or laser direct writing, enabling high-throughput manufacturing of large-scale LNOI-based photonic integrated circuits.

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