Laser coverage on defect in laser conditioning process

2012 ◽  
Vol 24 (6) ◽  
pp. 1385-1390 ◽  
Author(s):  
代福 Dai Fu ◽  
杨李茗 Yang Liming
Keyword(s):  
Laser Conditioning ◽  
Conditioning Process

Study of laser conditioning process for optical films

2002 ◽  
Author(s):  
Ren Huan ◽  
Jiang Xiao-dong ◽  
Huang Zu-xin ◽  
Gan Rong-bing ◽  
Zhong Wei
Keyword(s):  
Laser Conditioning ◽  
Conditioning Process ◽  
Optical Films

Improvement of laser damage resistance at surface of DKDP crystal by laser conditioning process

2017 ◽  
Vol 25 (8) ◽  
pp. 1987-1994
Author(s):  
罗 阳 LUO Yang ◽  
胡国行 HU Guo-hang ◽  
赵元安 ZHAO Yuan-an ◽  
杨留江 YANG Liu-jiang ◽  
曹 珍 CAO Zhen ◽  
...  
Keyword(s):  
Laser Damage ◽  
Damage Resistance ◽  
Laser Conditioning ◽  
Conditioning Process

Laser conditioning process combining N/1 and S/1 programs to improve the damage resistance of KDP crystals

2009 ◽  
Author(s):  
Yuanan Zhao ◽  
Guohang Hu ◽  
Jianda Shao ◽  
Xiaofeng Liu ◽  
Hongbo He ◽  
...  
Keyword(s):  
Damage Resistance ◽  
Laser Conditioning ◽  
Conditioning Process ◽  
Kdp Crystals

SOCRATE: an optical bench dedicated to the understanding and improvement of a laser conditioning process

2006 ◽  
Vol 45 (33) ◽  
pp. 8506 ◽  
Author(s):  
Bertrand Bertussi ◽  
Hervé Piombini ◽  
David Damiani ◽  
Matthieu Pommies ◽  
Xavier Le Borgne ◽  
...  
Keyword(s):  
Optical Bench ◽  
Laser Conditioning ◽  
Conditioning Process

Nondestructive optical characterization of KH 2 PO 4 crystals heterogeneities and adapted excimer laser conditioning process

2005 ◽  
Author(s):  
Matthieu Pommiès ◽  
David Damiani ◽  
Bertrand Bertussi ◽  
Jérémie Capoulade ◽  
Jean-Yves Natoli ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Optical Characterization ◽  
Laser Conditioning ◽  
Conditioning Process

Conditioning: Process or Procedure?

1978 ◽  
Vol 23 (4) ◽  
pp. 230-231
Author(s):  
BEN A. WILLIAMS
Keyword(s):  
Conditioning Process

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

A sodium dichloroisocyanurate-based conditioning process for the improvement of sludge dewaterability and mechanism studies

2021 ◽  
Vol 284 ◽  
pp. 112020
Author(s):  
Yanting Dong ◽  
Yanwen Shen ◽  
Dongdong Ge ◽  
Chang Bian ◽  
Haiping Yuan ◽  
...  
Keyword(s):  
Conditioning Process ◽  
Sodium Dichloroisocyanurate ◽  
Sludge Dewaterability
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