Study on Thermal Shock Resistance of Insulated Metal Substrate

2005 ◽  
pp. 1737-1742
Author(s):  
Liquan Guo ◽  
Yang Liu ◽  
Ju Sheng Ma
Keyword(s):  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Metal Substrate ◽  
Shock Resistance

Study on Thermal Shock Resistance of Insulated Metal Substrate

2005 ◽  
Vol 475-479 ◽  
pp. 1737-1742
Author(s):  
Liquan Guo ◽  
Yang Liu ◽  
Ju Sheng Ma
Keyword(s):  
Thermal Conductivity ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Room Temperature ◽  
Metal Substrate ◽  
Anodic Film ◽  
Excellent Performance ◽  
Insulating Layer ◽  
Shock Resistance ◽  
Thermal Shocks

Anodizing technique was applied to prepare insulated metal substrates (IMS) for BGA packaging. “Ideal” IMS used anodic film of aluminum as the insulating layer instead of epoxy, which led to higher thermal conductivity. But the thermal shock resistance of IMS is poor because of the great difference of thermal expansion coefficient between aluminum and its anodic film. In this study, different anodizing processes of aluminum were analyzed. The parameters, which can affect the thermal shock resistance of IMS, especially the surface temperature of Al substrate, were studied. The anodic film obtained with the optimized parameters of anodizing process had excellent performance, such as the resistivity was over 1013Ω·cm, the breakdown voltage was higher than 600V, and the most important thing was that it could resist thermal shocks between room temperature and 300°C. Then BGA packaging was successfully performed based on this IMS.

Thermal shock resistance of Ti3SiC2 ceramic under extremely rapid thermal cycling

2021 ◽  
Vol 866 ◽  
pp. 158985
Author(s):  
Xiaojia Su ◽  
Yiwang Bao ◽  
Detian Wan ◽  
Haibin Zhang ◽  
Ludi Xu ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Shock Resistance ◽  
Rapid Thermal Cycling
Sign in / Sign up

Export Citation Format

Share Document