A Review on Drilling Printed Circuit Boards

Drilling is a particularly complicated machining process, and it becomes much more complicated when the workpiece is printed circuit boards (PCBs). PCB is composite materials with anisotropy. Even a small defect in PCB may cause great losses. Both the drilling process and PCB structure design have been researched by many scholars. But the investigations into the drilling processes of PCB are not systematic. The present review article address the report about tool materials and geometrics, cutting force, cutting temperature, radial run-out and damages occurring in drilling processes. And as a conclusion, some of these critical issues are proposed to meet the challenges in analysis and optimization for PCB drilling.

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Using of thermal model to determine the parameters of printed circuit boards’ drilling process

ELECTRONICS Science Technology Business ◽

10.22184/1992-4178.2017.166.6.190.192 ◽

2017 ◽

pp. 190-192

Author(s):

S. Vantsov ◽

Z. Maung Maung

Keyword(s):

Thermal Model ◽

Printed Circuit Boards ◽

Drilling Process ◽

Circuit Boards ◽

Printed Circuit

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The Drilling Vibration Behavior of a Twisted Microdrill

Journal of Manufacturing Science and Engineering ◽

10.1115/1.1813472 ◽

2004 ◽

Vol 126 (4) ◽

pp. 719-726 ◽

Cited By ~ 27

Author(s):

Bo-Wun Huang

Keyword(s):

Dynamic Characteristics ◽

Printed Circuit Boards ◽

Thrust Force ◽

Time Dependent ◽

Drilling Process ◽

Improve Quality ◽

Circuit Boards ◽

Rotating Speed ◽

Printed Circuit ◽

Vibration Model

The dynamic characteristics of a microdrill in the drilling process were investigated in this study. The trend toward higher density printed circuit boards requires smaller holes, down to 0.3 mm in diameter, to be drilled through the board layers. To improve quality, produce a higher production rate, and avoid drill breakage, the dynamic characteristics of the microdrilling process must be studied. A stepped pretwisted beam is used to simulate the microdrill. A moving Winkler-Type elastic foundation is used to approximate the drilling process. A time-dependent vibration model for drilling is presented. The rotating speed, pretwisted angle, and thrust force effects of the microdrill are considered. The numerical analysis indicates that the natural frequency is reduced suddenly as the microdrill moves into a workpiece.

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Estimation of Micro-Hole Shape in Laser Direct Drilling of High Heat Radiation Typed Printed Circuit Boards (Process Monitoring with a High Speed Camera)

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.625.172 ◽

2014 ◽

Vol 625 ◽

pp. 172-177

Author(s):

Suguru Onchi ◽

Toshiki Hirogaki ◽

Eiichi Aoyama ◽

Keiji Ogawa

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Drill Hole ◽

High Heat ◽

Heat Radiation ◽

Drilling Process ◽

High Speed Camera ◽

Circuit Boards ◽

Processing Efficiency ◽

Printed Circuit

Recently, the development of electronic devices, such as smartphones, has meant that printed circuit boards (PCBs) have become complex multi-layer ones to provide both multiple functions and be compact. Blind via holes (BVHs) connecting the layers of the multi-layer board are processed by using a CO2 laser. The many benefits of direct processing by CO2 laser include a lower disconnect of the hole position as a result of the base drilling process in the inner layer circuit pattern. Also, efficiently dissipating heat from components improves the quality of the product as digital home appliances are increasingly compact, lightweight, and thinner. Using PCBs raises the radiation performance by the addition of alumina filler at the insulated layer. However, adding alumina filler means that laser processing is difficult, processing efficiency is reduced, and debris on the surface around the drilled hole increases. We consider what causes the changes in the processing hole by changes in the alumina filler content on the basis of data on drilling phenomena gathered with a high-speed camera. We found that the insulating layer material didn’t effect the diameter of the drill hole per laser spot diameter. The cross-section processing is done in a cone initially, and the truncated cone is then processed. And, we found that the hole depth and processing overhang was reduced, and the amount of scattering increased with the amount of alumina content filler.

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