A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting

2011 ◽  
Vol 264-265 ◽  
pp. 1252-1257 ◽  
Author(s):  
Kuo Cheng Huang ◽  
Min Wei Hung ◽  
Shih Feng Tseng ◽  
Chi Hung Hwang
Keyword(s):  
Fracture Mechanics ◽  
Weight Function ◽  
Glass Substrate ◽  
Thermal Stresses ◽  
Local Buckling ◽  
Brittle Materials ◽  
Mode I ◽  
Mode Ii ◽  
Thermal Fracture ◽  
Mode Ii Fracture

Thermal fracture-cutting technology (TFCT) for brittle materials has become the main technology for LCD glass substrate cutting to meet the low residual thermal stresses requirement. Based on the thermal weight function principle of fracture mechanics, this paper presents thermal weight function distributions for the mode-I and mode-II fracture model, and the fracture phenomenon under a variety of cutting paths, such as tilt crack, split crack, twist crack, and local buckling.

scholarly journals The influence of interlayer/epoxy adhesion on the mode-I and mode-II fracture response of carbon fibre/epoxy composites interleaved with thermoplastic veils

2020 ◽  
Vol 192 ◽  
pp. 108781 ◽  
Author(s):  
Dong Quan ◽  
Brian Deegan ◽  
René Alderliesten ◽  
Clemens Dransfeld ◽  
Neal Murphy ◽  
...  
Keyword(s):  
Carbon Fibre ◽  
Epoxy Composites ◽  
Mode I ◽  
Mode Ii ◽  
Mode Ii Fracture

Comparison of mode I and mode II fracture toughness of an 8090 AlLi alloy

1991 ◽  
Vol 149 (1) ◽  
pp. L1-L3 ◽  
Author(s):  
S.V. Kamat ◽  
N. Eswara Prasad ◽  
G. Malakondaiah
Keyword(s):  
Fracture Toughness ◽  
Mode I ◽  
Mode Ii ◽  
Mode Ii Fracture ◽  
Mode Ii Fracture Toughness
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