Utilization of Waste Printed Circuit Board Resin in Controlled Low-Strength Materials

In this investigation, waste printed circuit board resin powder (WPCBRP) was used to replace 0-30% of the fine aggregate in controlled low-strength materials (CLSM), to explore their rheological behavior, mechanical behavior, and durability. The results thus obtained demonstrate that when 10% of the fine aggregate was replaced by WPCBRP, the adjusted slump flow, setting time, and compressive strength could all met the standards at the ages of 12 hours and 28 days, with a high impedance of 1.54-1.63 kΩcm. CLSM with WPCBRP has a similar water permeability, of between 10-8 and 10-9 cm/s, to that of compacted clay. Therefore, this form of CLSM is impervious, and has a lower compacted settlement when compared with clay.