scholarly journals Intermetallic compound formation at room temperature in a thin film Au/Al diffusion couple.

1987 ◽  
Vol 38 (5) ◽  
pp. 199-200 ◽  
Author(s):  
Hidenori TOMIOKA ◽  
Hideo KITAMURA ◽  
Shigetomo UEDA
Keyword(s):  
Thin Film ◽  
Intermetallic Compound ◽  
Diffusion Couple ◽  
Room Temperature ◽  
Compound Formation ◽  
Intermetallic Compound Formation

Intermetallic Compound Formation in Ti/Al Alloy Thin Film Couples and Its Role in Electromigration Lifetime

1994 ◽  
Vol 141 (1) ◽  
pp. 302-306 ◽  
Author(s):  
D. Jawarani ◽  
J. P. Stark ◽  
H. Kawasaki ◽  
J. O. Olowolafe ◽  
C. C. Lee ◽  
...  
Keyword(s):  
Thin Film ◽  
Intermetallic Compound ◽  
Al Alloy ◽  
Alloy Thin Film ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Electromigration Lifetime

Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–Cu solder and thin film metallization

2003 ◽  
Vol 18 (9) ◽  
pp. 2109-2114 ◽  
Author(s):  
J. S. Ha ◽  
T. S. Oh ◽  
K. N. Tu
Keyword(s):  
Thin Film ◽  
Intermetallic Compound ◽  
Solubility Limit ◽  
Molten Solder ◽  
Interfacial Reactions ◽  
Interfacial Stability ◽  
Compound Formation ◽  
Cu Content ◽  
Intermetallic Compound Formation ◽  
Interfacial Intermetallic Compound

Interfacial reactions and intermetallic compound formation of the eutectic Sn–0.7Cu and hypereutectic Sn–3Cu on thin film metallization of Al/Ni/Cu, Al/Cu, and Al/Ni were investigated. While the Ni layer of Al/Ni/Cu was almost consumed by Sn–0.7Cu after one reflow at 240 °C, most of it was preserved with Sn–3Cu even after ten reflows. Since the Cu content in Sn–0.7Cu is below the solubility limit of Cu in Sn at 240 °C, the Cu layer of Al/Ni/Cu was dissolved completely into Sn–0.7Cu, and the Ni was exposed to the molten solder to form intermetallics. As Cu content in Sn–3Cu is more than the solubility limit, intermetallics formed between the solder and the Cu layer, but not the Ni layer, of Al/Ni/Cu. The supersaturation of Cu in Sn–3Cu was found to be beneficial in reducing the interfacial intermetallic compound formation and in improving the interfacial stability.

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation
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