Application of Taguchi-Based Grey System for Multi Aspects Optimization on Wire Electric Discharge Machining of Aluminum-Graphene Nanoplatelets Composites

2021 ◽  
Vol 15 (1) ◽  
Author(s):  
P. Bhanu Prakash ◽  
R. Mahesh ◽  
D. Merwin Rajesh ◽  
D. Babu ◽  
B. Devika
Keyword(s):  
Electric Discharge ◽  
Graphene Nanoplatelets ◽  
Grey System ◽  
Electric Discharge Machining ◽  
Wire Electric Discharge Machining

Optimization and Prediction of Machining Responses Using Response Surface Methodology and Adaptive Neural Network by Wire Electric Discharge Machining of Alloy-X

2021 ◽  
Vol 1026 ◽  
pp. 28-38
Author(s):  
I. Vishal Manoj ◽  
S. Narendranath ◽  
Alokesh Pramanik
Keyword(s):  
Neural Network ◽  
Surface Roughness ◽  
Artificial Neural Network ◽  
Response Surface ◽  
Electric Discharge ◽  
Cutting Speed ◽  
Electric Discharge Machining ◽  
Surface Method ◽  
Wire Electric Discharge Machining ◽  
Pulse On Time

Wire electric discharge machining non-contact machining process based on spark erosion technique. It can machine difficult-to-cut materials with excellent precision. In this paper Alloy-X, a nickel-based superalloy was machined at different machining parameters. Input parameters like pulse on time, pulse off time, servo voltage and wire feed were employed for the machining. Response parameters like cutting speed and surface roughness were analyzed from the L25 orthogonal experiments. It was noted that the pulse on time and servo voltage were the most influential parameters. Both cutting speed and surface roughness increased on increase in pulse on time and decrease in servo voltage. Grey relation analysis was performed to get the optimal parametric setting. Response surface method and artificial neural network predictors were used in the prediction of cutting speed and surface roughness. It was found that among the two predictors artificial neural network was accurate than response surface method.

Development of Multi-Wire Electric Discharge Machining for SiC Wafer Processing

2014 ◽  
Vol 778-780 ◽  
pp. 776-779 ◽  
Author(s):  
Masumi Ogawa ◽  
Kei Mine ◽  
Seiki Fuchiyama ◽  
Yasuhiro Tawa ◽  
Tomohisa Kato
Keyword(s):  
Electric Discharge ◽  
Wire Edm ◽  
Electric Discharge Machining ◽  
Entire Surface ◽  
Effective Removal ◽  
Diameter Ingot ◽  
Wire Electric Discharge Machining ◽  
Wafer Processing ◽  
Sic Wafer ◽  
Electric Discharge Pulse

In order to slice the larger size ingot toward 6 inch of silicon carbide (SiC), we are developing Multi-wire Electric Discharge Machining (EDM). To prevent wire break during slicing, we have developed the electric discharge pulse control system. So far, with 10 multi-wires, we have succeeded in slicing of 4 inch SiC balk single crystal without wire break. High quality slicing surface (e.g. small value of around 10 μm of SORI for 3 inchi wafer) was also achieved. By polishing methode, EDM-sliced wafer was estimated to have the uniform thickness of damaged layer over the entire surface. We confirmed that the wafer sliced by EDM can be processed in the later process, by grinding the 3 inch wafer. And it was confirmed that 6 inch ingot can be sliced with 10 multi-wire EDM, by slicing the boule of SiC poly crystal. For the larger diameter ingot than 4 inch, Multi-wire EDM will be practically used by the effective removal of machining chips from the machining clearance between the wire and work.

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