scholarly journals Fabrication and Characterization of 32x32 Silicon Cantilever Array using MEMS Process

Author(s):  
Young-Sik Kim ◽  
Kee-Yeol Na ◽  
Yoon-Soo Shin ◽  
Keun-Hyung Park ◽  
Yeong-Seuk Kim
2001 ◽  
Vol 40 (28) ◽  
pp. 5040 ◽  
Author(s):  
Gregor Schürmann ◽  
Wilfried Noell ◽  
Urs Staufer ◽  
Nico F. de Rooij ◽  
Rolf Eckert ◽  
...  

Author(s):  
A. Alvin Barlian ◽  
Sung-Jin Park ◽  
Vikram Mukundan ◽  
Beth L. Pruitt

This paper presents the design, fabrication, and characterization of unique piezoresistive microfabricated shear stress sensors for direct measurements of shear stress underwater. The uniqueness of this design is in its transduction scheme which uses sidewall-implanted piezoresistors to measure lateral force (and shear stress), along with traditional top-implanted piezoresistors to detect normal forces. Aside from the oblique-implant technique, the fabrication process also includes hydrogen anneal step to smooth scalloped silicon sidewalls due to Deep Reactive Ion Etch process, which was shown to reduce 1/f noise level by almost an order of magnitude for the sidewall-implanted piezoresistors. Lateral sensitivity characterization of the sensors was done using a microfabricated silicon cantilever force sensor, while out-of-plane characterization was done using Laser Doppler Vibrometry technique. In-plane sensitivity and out-of-plane crosstalk were characterized, as well as hysteresis and repeatability of the measurements. The sensors are designed to be used underwater for various applications.


Sensors ◽  
2017 ◽  
Vol 17 (6) ◽  
pp. 1191 ◽  
Author(s):  
Marjan Zakerin ◽  
Antonin Novak ◽  
Masaya Toda ◽  
Yves Emery ◽  
Filipe Natalio ◽  
...  

2016 ◽  
Vol 157 ◽  
pp. 78-82 ◽  
Author(s):  
Deepak G. Khushalani ◽  
Rajesh S. Pande ◽  
Rajendra M. Patrikar

2007 ◽  
Vol 353-358 ◽  
pp. 2924-2927
Author(s):  
Yu Feng Jin ◽  
Hao Tang ◽  
Zhen Feng Wang

Vacuum packaging is very important for some micro-electro-mechanical systems (MEMS) devices to perform their basic functions properly and to enhance their reliability by keeping these devices away from harmful external environment. In order to maintain high vacuum in a cavity of MEMS devices, residual gases and leaking gases must be eliminated by embedded getter materials. Micro/Nano film getters absorbing gases inside the tiny cavity of MEMS packaging were introduced in this paper. The fabrication and characterization of micro/nano getters for MEMS applications were also presented. Various kinds of patterned getter films were prepared for different MEMS applications. The activation temperature and sorption capacity of the nonevaporable getter (NEG[1]) films was investigated. The formation of micro/nano films on the inner surface of MEMS devices is totally compatible with Si-based MEMS process and illustrates the applicability of the technique in vacuum maintenance of MEMS devices.


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