scholarly journals Investigating the Joining of Ni3Al Intermetallic Compound, using Transient Liquid Phase (TLP) Method with Cu Interlayer

2020 ◽  
Vol 38 (04) ◽  
2015 ◽  
Vol 57 (7) ◽  
pp. 1293-1299 ◽  
Author(s):  
V. E. Ovcharenko ◽  
E. N. Boyangin ◽  
M. M. Myshlyaev ◽  
Yu. F. Ivanov ◽  
K. V. Ivanov

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