Investigating the Joining of Ni3Al Intermetallic Compound, using Transient Liquid Phase (TLP) Method with Cu Interlayer
1996 ◽
Vol 43
(10)
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pp. 1208-1214
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2020 ◽
Vol 56
(11)
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pp. 1122-1126
V. E. Ovcharenko
◽
K. O. Akimov
2015 ◽
Vol 21
(3)
◽
pp. 616-616
Chang-Sup Oh
◽
Chang-Suk Han
2019 ◽
Vol 237
◽
pp. 37-40
◽
Qian Wang
◽
Yang Fu
◽
Qiang Lang
◽
Jiuchun Yan
◽
Shengyong Chen
2019 ◽
Vol 55
(2)
◽
pp. 191-196
◽
V. E. Ovcharenko
◽
E. N. Boyangin
◽
K. O. Akimov
◽
K. V. Ivanov
1996 ◽
Vol 35
(6)
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pp. 623-631
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2015 ◽
Vol 354
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pp. 287-291
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H. Yoshizaki
◽
A. Hashimoto
◽
Y. Kaneno
◽
S. Semboshi
◽
F. Hori
◽
...
Jihou Liu
◽
Hongyun Zhao
◽
ZhouLin Li
◽
Xiaoguo Song
2015 ◽
Vol 57
(7)
◽
pp. 1293-1299
◽
V. E. Ovcharenko
◽
E. N. Boyangin
◽
M. M. Myshlyaev
◽
Yu. F. Ivanov
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K. V. Ivanov