Evaluation of Residual Stress in Semiconductor Chips during Resin-Molding Process Using Piezoresistive Test Chips and a Finite Element Analysis Method
2006 ◽
Vol 9
(3)
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pp. 186-194
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2021 ◽
Vol 1744
(2)
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pp. 022017
2019 ◽
Vol 123
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pp. 64-74
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2012 ◽
Vol 52
(1)
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pp. 164-170
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1994 ◽
Vol 60
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pp. 860-866
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