scholarly journals Report on “The 2nd Singapore-Japan Microelectronics Packaging Technology Seminar”

1997 ◽  
Vol 13 (5) ◽  
pp. 43-44
Author(s):  
Akira Okamoto
Keyword(s):  
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Packaging Technology

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
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Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
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Development of Silicon Wafer Packaging Technology for Deep UV LED

2020 ◽  
Vol 140 (7) ◽  
pp. 152-157
Author(s):  
Hirofumi Chiba ◽  
Yukio Suzuki ◽  
Yoshiaki Yasuda ◽  
Mitsuyasu Kumagai ◽  
Takaaki Koyama ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Packaging Technology ◽  
Uv Led ◽  
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scholarly journals Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

2001 ◽  
Vol 2 (4) ◽  
pp. 34-38 ◽  
Author(s):  
Duck-Jung Lee ◽  
Yun-Hi Lee ◽  
Gwon-Jin Moon ◽  
Jun-Dong Kim ◽  
Won-Do Choi ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Packaging Technology ◽  
Joint Method
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