Research on Characteristics of Transparent Microstrip Transmission Lines According to Materials and Configurations of Transparent Electrodes for High Frequency Applications

2018 ◽  
Vol 55 (4) ◽  
pp. 27-33
Author(s):  
Hoon-Hee Lee ◽  
Chang Won Jung
Keyword(s):  
Transmission Lines ◽  
High Frequency ◽  
Transparent Electrodes ◽  
Microstrip Transmission Lines

Patterned Macrovoids for Dielectric Constant Control of High Frequency Circuit Substrates

1986 ◽  
Vol 72 ◽  
Author(s):  
M. Kahn ◽  
B. Kriese
Keyword(s):  
Dielectric Constant ◽  
Transmission Lines ◽  
High Frequency ◽  
Thermal Conductance ◽  
Propagation Delay ◽  
Constant Control ◽  
Microstrip Transmission Lines

AbstractFugitive ink and tape technology permit the inclusion of flat voids at predetermined locations in ceramic microcircuit substrates. Calculations show that critical stray capacitances can be reduced by as much as 65% and the propagation delay of microstrip transmission lines by 30% and more. The selectivity of the void location permits the retention of the full thermal conductance of the substrate under heat dissipating elements.

Dispersion characteristics of curved microstrip transmission lines

1990 ◽  
Vol 38 (9) ◽  
pp. 1366-1370 ◽  
Author(s):  
J.S. Roy ◽  
D.R. Poddar ◽  
A. Mukherjee ◽  
S.K. Chowdhury
Keyword(s):  
Transmission Lines ◽  
Dispersion Characteristics ◽  
Microstrip Transmission Lines

High-frequency transmission lines

1994 ◽  
pp. 173-211
Author(s):  
J. Dunlop ◽  
D. G. Smith
Keyword(s):  
Transmission Lines ◽  
High Frequency
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