scholarly journals Molecular dynamics simulation of the diffusion bonding and tensile behavior of a Cu-Al interface

2007 ◽  
Vol 56 (1) ◽  
pp. 407
Author(s):  
Liu Hao ◽  
Ke Fu-Jiu ◽  
Pan Hui ◽  
Zhou Min
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Diffusion Bonding ◽  
Tensile Behavior ◽  
Dynamics Simulation

Molecular dynamics simulation of diffusion bonding of Al–Cu interface

2014 ◽  
Vol 22 (6) ◽  
pp. 065013 ◽  
Author(s):  
Chang Li ◽  
Dongxu Li ◽  
Xiaoma Tao ◽  
Hongmei Chen ◽  
Yifang Ouyang
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Diffusion Bonding ◽  
Dynamics Simulation

[P73] Molecular dynamics simulation of diffusion bonding of Al-Cu interface

Calphad ◽  
2015 ◽  
Vol 51 ◽  
pp. 396-397
Author(s):  
Chang Li ◽  
Dongxu Li ◽  
Xiaoma Tao ◽  
Hongmei Chen ◽  
Yifang Ouyang
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Diffusion Bonding ◽  
Dynamics Simulation

Molecular dynamics simulation of tensile behavior of diffusion bonded Ni/Al nanowires

2013 ◽  
Vol 27 (1) ◽  
pp. 43-46 ◽  
Author(s):  
Zhenjiang Hu ◽  
Junjie Zhang ◽  
Yongda Yan ◽  
Jiuchun Yan ◽  
Tao Sun
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Tensile Behavior ◽  
Dynamics Simulation
Sign in / Sign up

Export Citation Format

Share Document