Implementing Single-Row Process Plate Design for Pre-Encapsulated Lead Frame
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This paper presents the application of an innovative design of wirebond process plate during wirebonding process of thin semiconductor carrier such as the pre-encapsulated leadframe. The implementation of the specialized process plate aims to improve the conventional method of wirebonding from panel type to single-row design to reduce the occurrence of warpage on thin leadframes. In this study, an 85% reduction for warpage level is achieved after the introduction of the new design of process plate. Future works could use the improved process plate design for devices of similar configuration.
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2007 ◽
Vol 2007
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pp. 30-31
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2014 ◽
Keyword(s):
2010 ◽
Vol 130
(9)
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pp. 1546-1553
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2018 ◽
Vol 12
(5)
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pp. 393
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