scholarly journals Off-centered Ball Resolution Through Multi-hole Process Plate Implementation at Wirebond Process

2021 ◽  
pp. 45-50
Author(s):  
J. Pulido ◽  
F. R. Gomez ◽  
E. Graycochea Jr.
Keyword(s):  
Semiconductor Manufacturing ◽  
New Technologies ◽  
Single Row ◽  
Plate Design ◽  
Panel Type ◽  
Manufacturing Assembly ◽  
Centered Ball ◽  
Bouncing Effect

With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents the modification and improvement done on the process plate design to eliminate the bouncing effect of the silicon die that leads to off-centered ball (OCB) reject during the formation of wire on a quad flat no-leads (QFN) device. The panel type single-row process plate cannot totally vacuum the warped leadframe and this is resulting to off-centered ball. Through changing the panel type single-row process plate to panel type multi-hole process will have a strong vacuum sucked underneath the leadframe and eliminates the occurrence of off-centered ball. Future works could use the improved process plate design for devices of similar configuration.

scholarly journals Implementing Single-Row Process Plate Design for Pre-Encapsulated Lead Frame

2020 ◽  
pp. 26-30
Author(s):  
R. Rodriguez ◽  
F. R. Gomez ◽  
J. Pulido
Keyword(s):  
Conventional Method ◽  
Lead Frame ◽  
Innovative Design ◽  
Single Row ◽  
Plate Design ◽  
Thin Semiconductor ◽  
Panel Type

This paper presents the application of an innovative design of wirebond process plate during wirebonding process of thin semiconductor carrier such as the pre-encapsulated leadframe. The implementation of the specialized process plate aims to improve the conventional method of wirebonding from panel type to single-row design to reduce the occurrence of warpage on thin leadframes. In this study, an 85% reduction for warpage level is achieved after the introduction of the new design of process plate. Future works could use the improved process plate design for devices of similar configuration.

scholarly journals Lead Scratch Resolution through Wirebonding Process Optimization on QFN Packages

2020 ◽  
pp. 29-33
Author(s):  
Jonathan Pulido ◽  
Frederick Ray Gomez ◽  
Edwin Graycochea Jr.
Keyword(s):  
Process Optimization ◽  
Parameter Optimization ◽  
Semiconductor Manufacturing ◽  
New Technologies ◽  
Process Parameter ◽  
Process Parameter Optimization ◽  
Bond Force ◽  
Manufacturing Assembly

With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents an improvement done in quad-flat no-leads (QFN) leadframe package to resolve the quantity of unit rejection due to leads scratch underneath the leadframe. Moreover, the reject manifestation was captured after wirebonding process. Parameter optimization particularly for the second bond with the combination of bond force and bond scrubbing parameters was done to totally eliminate this type of issue after wirebonding process. With the wirebonding process optimization and improvement done, a reduction of 95 percent of leads scratch occurrence was achieved.

scholarly journals Ball Misplace Mitigation through Process Optimization of Advanced Leadframe Package

2020 ◽  
pp. 35-38
Author(s):  
Bryan Christian S. Bacquian ◽  
Frederick Ray I. Gomez ◽  
Edwin M. Graycochea Jr.
Keyword(s):  
Process Optimization ◽  
Parameter Optimization ◽  
Semiconductor Manufacturing ◽  
Manufacturing Industry ◽  
Solder Ball ◽  
Development Phase ◽  
Solder Paste ◽  
Stencil Printing ◽  
Printing Process ◽  
Centered Ball

One of the challenging assembly processes in semiconductor manufacturing industry is stencil printing using solder paste as direct material. With this technology, some issues were encountered during the development phase of an advanced leadframe device and one of which is the solder ball misplace or off-centered ball. This paper, hence, focused on addressing the ball misplace issue at stencil printing process. Comprehensive parameter optimization particularly on the print speed and print force was employed to eliminate or significantly reduce the ball misplace defect at stencil printing process. With this process optimization and improvement, a reduction of around 96 percent ball misplace occurrence was achieved.

Dynamics Model and Vibration Control of Piezoelectric Feeder in Semiconductor Manufacturing Assembly

2018 ◽  
Vol 31 (1) ◽  
pp. 97-107
Author(s):  
Zhili Long ◽  
Hao Shen ◽  
Jianguo Zhang ◽  
Shuang Zhao ◽  
Yongcheng Lin ◽  
...  
Keyword(s):  
Vibration Control ◽  
Semiconductor Manufacturing ◽  
Dynamics Model ◽  
Manufacturing Assembly

Special Issue on on Biomanufacturing

2009 ◽  
Vol 3 (5) ◽  
pp. 493-493
Author(s):  
Mamoru Mitsuishi
Keyword(s):  
New Technologies ◽  
Dental Treatment ◽  
Artificial Bone ◽  
Special Issue ◽  
Medical Systems ◽  
Mr Fluids ◽  
Biomedical Systems ◽  
Irradiation Therapy ◽  
Cad Cam ◽  
Manufacturing Assembly

The creation of innovative medical and welfare machines is indispensable to assuring the health, comfort, safety and security of citizens. In the biomedical area, manufacturing and automation technologies are essential in making these new technologies affordable, and there are many application areas where these technologies can contribute. Such application areas include medical processes, biomedical systems and human-machine interfaces. Papers were collected on these areas to organize this special issue on biomanufacturing. The first paper relates to dental treatment using a laser, the second paper discusses a droplet system using a magnetically-driven microtool and the third paper describes artificial bone manufacturing using 3D inkjet printing. These three papers relate to processes and the subsequent papers are related to systems. These systems-oriented papers include a medical CAD/CAM system for minimally invasive surgery and an irradiation therapy system. In addition, papers related to blood pressure simulation and the technologizing and digitalization of medical skills are included. These are all useful in the design of medical systems. Finally, papers for rehabilitation systems using ER and MR fluids, and a paper on mental stress in manufacturing assembly workers are presented. I would like to express my sincere thanks to all of the authors and reviewers of these papers.

scholarly journals A Wafer Bin Map “Relaxed” Clustering Algorithm for Improving Semiconductor Production Yield

2020 ◽  
Vol 10 (1) ◽  
pp. 231-245
Author(s):  
Crescenzio Gallo ◽  
Vito Capozzi
Keyword(s):  
Semiconductor Manufacturing ◽  
Clustering Algorithm ◽  
Production Control ◽  
New Technologies ◽  
Visual Exploration ◽  
Production Yield ◽  
Subjective Time ◽  
Manufacturing Defects ◽  
Use Of Resources ◽  
Reducing Costs

AbstractThe semiconductor manufacturing process involves long and complex activities, with intensive use of resources. Producers compete through the introduction of new technologies for increasing yield and reducing costs. So, yield improvement is becoming increasingly important since advanced production technologies are complex and interrelated. In particular, Wafer Bin Maps (WBMs) presenting specific fault models provide crucial information to keep track of process problems in semiconductor manufacturing. Production control is often based on the “judgement” of expert engineers who, however, carry out the analysis of map templates through simple visual exploration. In this way, existing studies are subjective, time consuming, and are also limited by the capacity of human recognition. This study proposes a network-based data mining approach, which integrates correlation graphs with clustering analysis to quickly extract patterns from WBMs and then bind them to manufacturing defects. An empirical study has been conducted on real production data for validating the proposed clustering algorithm, which showed a perfect correspondence between the malfunction patterns found by the algorithm and those discovered by human experts, so confirming the validity of our approach in its ability of correctly identifying actual defective patterns to help improving production yield.

Principles of Low-Vacuum SEM

1992 ◽  
Vol 50 (2) ◽  
pp. 1304-1305
Author(s):  
Klaus-Ruediger Peters
Keyword(s):  
New Technologies ◽  
High Vacuum ◽  
Optical Microscope ◽  
Specimen Surface ◽  
Electrical Field ◽  
Gaseous Environment ◽  
New Information ◽  
Gas Molecules ◽  
New Interactions ◽  
Gas Pressures

Only recently it became possible to expand scanning electron microscopy to low vacuum and atmospheric pressure through the introduction of several new technologies. In principle, only the specimen is provided with a controlled gaseous environment while the optical microscope column is kept at high vacuum. In the specimen chamber, the gas can generate new interactions with i) the probe electrons, ii) the specimen surface, and iii) the specimen-specific signal electrons. The results of these interactions yield new information about specimen surfaces not accessible to conventional high vacuum SEM. Several microscope types are available differing from each other by the maximum available gas pressure and the types of signals which can be used for investigation of specimen properties.Electrical non-conductors can be easily imaged despite charge accumulations at and beneath their surface. At high gas pressures between 10-2 and 2 torr, gas molecules are ionized in the electrical field between the specimen surface and the surrounding microscope parts through signal electrons and, to a certain extent, probe electrons. The gas provides a stable ion flux for a surface charge equalization if sufficient gas ions are provided.

Structural dynamics of P-type ATPase ion pumps

2019 ◽  
Vol 47 (5) ◽  
pp. 1247-1257 ◽  
Author(s):  
Mateusz Dyla ◽  
Sara Basse Hansen ◽  
Poul Nissen ◽  
Magnus Kjaergaard
Keyword(s):  
Structural Dynamics ◽  
Single Molecule ◽  
New Technologies ◽  
Atp Hydrolysis ◽  
Resonance Energy Transfer ◽  
Resonance Energy ◽  
Time Resolved ◽  
Dynamics Simulations ◽  
Types Of Information ◽  
P Type

Abstract P-type ATPases transport ions across biological membranes against concentration gradients and are essential for all cells. They use the energy from ATP hydrolysis to propel large intramolecular movements, which drive vectorial transport of ions. Tight coordination of the motions of the pump is required to couple the two spatially distant processes of ion binding and ATP hydrolysis. Here, we review our current understanding of the structural dynamics of P-type ATPases, focusing primarily on Ca2+ pumps. We integrate different types of information that report on structural dynamics, primarily time-resolved fluorescence experiments including single-molecule Förster resonance energy transfer and molecular dynamics simulations, and interpret them in the framework provided by the numerous crystal structures of sarco/endoplasmic reticulum Ca2+-ATPase. We discuss the challenges in characterizing the dynamics of membrane pumps, and the likely impact of new technologies on the field.

Meiotic CENP-C is a shepherd: bridging the space between the centromere and the kinetochore in time and space

2020 ◽  
Vol 64 (2) ◽  
pp. 251-261
Author(s):  
Jessica E. Fellmeth ◽  
Kim S. McKim
Keyword(s):  
Chromosome Segregation ◽  
New Technologies ◽  
Early Prophase ◽  
Unique Role ◽  
Kinetochore Assembly ◽  
M Phase ◽  
In Vivo Analysis ◽  
Meiosis I

Abstract While many of the proteins involved in the mitotic centromere and kinetochore are conserved in meiosis, they often gain a novel function due to the unique needs of homolog segregation during meiosis I (MI). CENP-C is a critical component of the centromere for kinetochore assembly in mitosis. Recent work, however, has highlighted the unique features of meiotic CENP-C. Centromere establishment and stability require CENP-C loading at the centromere for CENP-A function. Pre-meiotic loading of proteins necessary for homolog recombination as well as cohesion also rely on CENP-C, as do the main scaffolding components of the kinetochore. Much of this work relies on new technologies that enable in vivo analysis of meiosis like never before. Here, we strive to highlight the unique role of this highly conserved centromere protein that loads on to centromeres prior to M-phase onset, but continues to perform critical functions through chromosome segregation. CENP-C is not merely a structural link between the centromere and the kinetochore, but also a functional one joining the processes of early prophase homolog synapsis to late metaphase kinetochore assembly and signaling.

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