scholarly journals Addressing Package Voids on Extremely Small Leadframe Device

2020 ◽  
pp. 1-7
Author(s):  
A. Sumagpang Jr. ◽  
F. R. Gomez
Keyword(s):  
Risk Analysis ◽  
Design Of Experiments ◽  
Potential Risk ◽  
Semiconductor Device ◽  
Curing Time ◽  
Molding Process ◽  
Robust Solution ◽  
Molding Temperature ◽  
Corrective Actions

The paper focused in addressing the package voids defect of a semiconductor device utilizing an extremely small leadframe technology. Potential risk analysis and pareto diagram were completed to identify the top reject contributors and eventually come-up with the robust solution. A comprehensive design of experiments (DOE) was completed and solution validation was performed to formulate the effective corrective actions. Results revealed that package voids were addressed by optimizing the molding process focusing on the molding temperature and curing time. A significant improvement of 95 % for package voids reduction was achieved. For future works, the parameters and learnings could be used on devices with similar configuration.

scholarly journals Resolution of Damaged Metallization on Highly Complex Semiconductor Device

2020 ◽  
pp. 7-12
Author(s):  
Antonio Sumagpang Jr. ◽  
Frederick Ray Gomez
Keyword(s):  
Design Of Experiments ◽  
Semiconductor Device ◽  
Electrostatic Discharge ◽  
Test Design ◽  
Functional Testing ◽  
Assembly Process ◽  
Short Contact ◽  
Contact Test ◽  
Corrective Actions ◽  
Complex Semiconductor

The paper focused on the resolution of damaged metallization during assembly process that lead to gross open-short (O/S) rejections during functional testing of a highly complex semiconductor package. Numerous batches were put on hold due to not meeting the specification assigned for the short contact test. Design of experiments (DOE) on assembly processes were conducted and eventually identified the reject as an electrostatic discharge (ESD) related failure. Corrective actions and ESD controls significantly reduced the occurrence of damaged metallization with around 85% reduction.

scholarly journals Process Optimization to Eliminate Automatic Alignment Failures on the Scalable Device

2020 ◽  
pp. 1-7
Author(s):  
A. Sumagpang Jr. ◽  
F. R. Gomez ◽  
R. Rodriguez
Keyword(s):  
Risk Analysis ◽  
Process Optimization ◽  
Potential Risk ◽  
Reverse Flow ◽  
Final Test ◽  
Robust Solution ◽  
Automatic Alignment ◽  
Strip Testing ◽  
Assembly Defect ◽  
Error Proofing

The paper focused in addressing the auto align defect at in-strip testing of a semiconductor scalable device in a leadframe technology. Pareto diagram and potential risk analysis were completed to identify the top reject contributors and eventually come-up with the robust solution. Reverse flow was employed to eliminate the alignment issues. The reverse flow, which is testing prior singulation process, eventually resolved the auto align and other singulation related defects as testing is done on a strip form. Ultimately, the error-proofing or Poka-Yoke approach by reverse flow lead to the elimination of auto align failures at final test. For future   works, the parameters and learnings could be used on devices with similar assembly defect occurrence.

scholarly journals Wafer Saw Process Optimization for Die Chipping Mitigation on Extremely Small Leadframe Package

2020 ◽  
pp. 25-29
Author(s):  
A. Sumagpang Jr. ◽  
F. R. Gomez ◽  
B. C. Bacquian
Keyword(s):  
Risk Analysis ◽  
Process Optimization ◽  
Potential Risk ◽  
Design Of Experiment ◽  
Corrective Actions ◽  
Sawing Process ◽  
Cutting Modes

The paper focused in addressing the silicon die chippings defect at the wafer sawing process of an extremely small semiconductor package. In-depth potential risk analysis and Pareto diagram were done to identify the top reject contributors and eventually resolve the issue. A comprehensive design of experiment (DOE) was done and validation of the solution was employed to formulate the effective corrective actions. Results revealed that die chippings were addressed by optimizing the wafer sawing process through enabling the dressing, pre-cut and step-cutting modes. Ultimately, an improvement of 95% for die chippings reduction was achieved.

An approach to potential risk analysis of networked chemical plants

2000 ◽  
Vol 24 (2-7) ◽  
pp. 721-727 ◽  
Author(s):  
Akio Shindo ◽  
Hiroshi Yamazaki ◽  
Akifumi Toki ◽  
Reiko Maeshima ◽  
Ichiro Koshijima ◽  
...  
Keyword(s):  
Risk Analysis ◽  
Potential Risk ◽  
Chemical Plants

Petroleum Industry Environmental Performance and Risk

2014 ◽  
pp. 358-387
Author(s):  
Lidia Hrncevic
Keyword(s):  
Risk Assessment ◽  
Environmental Impact ◽  
Risk Analysis ◽  
Environmental Risk ◽  
Potential Risk ◽  
Environmental Risk Assessment ◽  
Petroleum Industry ◽  
Environmental Risks ◽  
Pollution Sources ◽  
Waste Generation

The petroleum industry holds long- and short-term environmental risks. Besides production fluids, all petroleum industry activities involve either use of fluids, which contain abundant substances, or waste generation, both associated with potential risk to the environment. The principal environmental risk associated with the petroleum industry is the risk of fluid spill/emission to the environment. Although in recent decades the risk analysis methodologies have matured, to date there is still no universally accepted methodology for environmental risk assessment in petroleum industry. In this chapter, the petroleum industry’s environmental incident history and statistics are presented. The environmental impact of the petroleum industry’s activities, its extent, and trends are analyzed. The overview of pollution sources with associated environmental risk is given along with the analysis of the causes and consequences of incidents in the petroleum industry.

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