power semiconductor device Recently Published Documents

Power Semiconductor ◽

Power Load ◽

Driver Circuit ◽

Load Characteristics

2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE) ◽

An Optimized Voltage Clamp Circuit for Accurate Power Semiconductor Device on-State Losses Measurement

10.1109/ceepe51765.2021.9475787 ◽

2021 ◽

Author(s):

Qiuping Yu ◽

Peng Sun ◽

Bin Zhao ◽

Yumeng Cai ◽

Zhibin Zhao

Keyword(s):

Voltage Clamp ◽

Semiconductor Device ◽

Research High Temperature Characteristics of 4.5kV New Power Semiconductor Device with Wave-based RC-GCT Structure

Journal of Physics Conference Series ◽

10.1088/1742-6596/1729/1/012005 ◽

2021 ◽

Vol 1729 ◽

pp. 012005

Author(s):

Bo Zhao ◽

Xianghua Luo ◽

Chuan Tang ◽

Qingchao Song ◽

Lifu Lu ◽

...

Keyword(s):

High Temperature ◽

Semiconductor Device ◽

Temperature Characteristics ◽

Statistics-based Switching Loss Characterization of Power Semiconductor Device

2020 IEEE Energy Conversion Congress and Exposition (ECCE) ◽

10.1109/ecce44975.2020.9236230 ◽

2020 ◽

Author(s):

Jiayang Lin ◽

Ke Ma ◽

Ye Zhu

Keyword(s):

Semiconductor Device ◽

Switching Loss ◽

Preparation and Low Temperature Sintering of Silver Nanoparticles Based Pastes for Power Semiconductor Device Interaction

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202630 ◽

2020 ◽

Author(s):

Qinchen Shen ◽

Xianwen Liang ◽

Gang Li ◽

Pengli Zhu ◽

Tao Zhao ◽

...

Keyword(s):

Silver Nanoparticles ◽

Low Temperature ◽

Semiconductor Device ◽

Low Temperature Sintering ◽

Power Semiconductor ◽

Device Interaction

Behavior of Space Charge in Polyimide and the Influence on Power Semiconductor Device Reliability

10.5772/intechopen.92165 ◽

2020 ◽

Author(s):

Kunihiko Tajiri ◽

Hirotaka Muto ◽

Didier Marty-Dessus ◽

Laurent Berquez ◽

Gilbert Teyssedre ◽

...

Keyword(s):

Space Charge ◽

Semiconductor Device ◽

Power Semiconductor ◽

Device Reliability ◽

Semiconductor Device Reliability

2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS) ◽

Study on Preparation and Application of Nano-copper Powder for Power Semiconductor Device Packaging

10.1109/sslchinaifws49075.2019.9019790 ◽

2019 ◽

Author(s):

Xu Pan ◽

Jiacheng Zhou ◽

Jingguo Zhang ◽

Zhaohui Zhao ◽

Minghui Liang ◽

...

Keyword(s):

Copper Powder ◽

Semiconductor Device ◽

Influence of Solder Layer Void on Thermal Stability for Power Semiconductor Device

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245120 ◽

2019 ◽

Author(s):

Wei Gao ◽

Qiao Guo ◽

Yuyu Peng ◽

Min Ren ◽

Bo Zhang ◽

...

Keyword(s):

Thermal Stability ◽

Semiconductor Device ◽

Power Semiconductor ◽

Solder Layer

Copper nanoplates based conductive paste as die attachment materials for power semiconductor device package

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245110 ◽

2019 ◽

Author(s):

Jilei Fan ◽

Gang Li ◽

Pengli Zhu ◽

Rong Sun ◽

Ching-Ping Wong

Keyword(s):

Semiconductor Device ◽

Die Attachment ◽

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

10.23919/ltb-3d.2019.8735247 ◽

2019 ◽

Author(s):

Kiichi Nagata ◽

Yoshiharu Kariya ◽

Shoji Horie

Keyword(s):

Ag Nanoparticles ◽

Deformation Behavior ◽

Semiconductor Device ◽

Power Semiconductor ◽

Sintered Ag ◽

Type Power ◽

Discrete Type