2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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9784904743072
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Where is the Sweet Spot for Panel Level Packaging?

2019 ◽  
Author(s):  
T Braun ◽  
K. -F. Becker ◽  
O. Hoelck ◽  
S. Voges ◽  
M. Woehrmann ◽  
...  
Keyword(s):  
Sweet Spot

Room temperature SiC wafer bonding using SAB methods

2019 ◽  
Author(s):  
Fengwen Mu ◽  
Yinghui Wang ◽  
Kenichi Iguchi ◽  
Haruo Nakazawa ◽  
Tadatomo Suga
Keyword(s):  
Wafer Bonding ◽  
Room Temperature ◽  
Sic Wafer

Low-temperature Cu-to-Cu direct bonding enabled by highly (111)- oriented and nanotwinned Cu

2019 ◽  
Author(s):  
Chih Chen ◽  
Jing-Ye Juang ◽  
Shih Yang Chang ◽  
Kai Cheng Shie ◽  
Yu Jin Li ◽  
...  
Keyword(s):  
Low Temperature
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