2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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TOTAL DOCUMENTS

98

(FIVE YEARS 98)

H-INDEX

1

(FIVE YEARS 1)

Published By IEEE

9784904743072

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Low-temperature Silver Sintering for Bonding 3D Power Modules

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735123 ◽

2019 ◽

Author(s):

Guo-Quan Lu ◽

Yunhui Mei ◽

Meiyu Wang ◽

Xin Li

Keyword(s):

Low Temperature ◽

Power Modules ◽

Silver Sintering

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Where is the Sweet Spot for Panel Level Packaging?

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735124 ◽

2019 ◽

Author(s):

T Braun ◽

K. -F. Becker ◽

O. Hoelck ◽

S. Voges ◽

M. Woehrmann ◽

...

Keyword(s):

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Oxide Removal for Low-Temperature Metal Thermo-Compression Wafer Bonding

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735225 ◽

2019 ◽

Author(s):

B. Rebhan ◽

V. Dragoi

Keyword(s):

Low Temperature ◽

Wafer Bonding ◽

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Microstructural Effects on Electrodeposited Copper Direct Bonding

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735163 ◽

2019 ◽

Author(s):

Jenn-Ming Song ◽

Zong-Yu Xie ◽

Zong-Yu Xie ◽

Chih-Pin Hung

Keyword(s):

Microstructural Effects

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Room temperature SiC wafer bonding using SAB methods

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735211 ◽

2019 ◽

Author(s):

Fengwen Mu ◽

Yinghui Wang ◽

Kenichi Iguchi ◽

Haruo Nakazawa ◽

Tadatomo Suga

Keyword(s):

Wafer Bonding ◽

Room Temperature ◽

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System Integration of Nanostructured Materials for Point-of-Care Immune Biosensing

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735235 ◽

2019 ◽

Author(s):

Younggeun Park ◽

Byunghoon Ryu ◽

Xiaogan Liang ◽

Katsuo Kurabayashi

Keyword(s):

Nanostructured Materials ◽

System Integration ◽

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Room Temperature GaN-Si Bonding via an Intermediate Atomic-Layer-Deposition Al2O3 Layer by Using O Ion Beam

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735103 ◽

2019 ◽

Author(s):

Xinhua Wang ◽

Shengli Zhu ◽

Binbin Jiao ◽

Sen Huang ◽

Ke Wei ◽

...

Keyword(s):

Atomic Layer Deposition ◽

Room Temperature ◽

Ion Beam ◽

Atomic Layer ◽

Al2o3 Layer ◽

Layer Deposition

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Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735262 ◽

2019 ◽

Author(s):

T. Saito ◽

H. Makita ◽

T. Moriwaki ◽

Y. Suzuki ◽

N. Kato ◽

...

Keyword(s):

Smooth Surface ◽

Room Temperature ◽

Thick Films ◽

Film Deposition

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Low temperature wafer bonding with gas cluster ion beams

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735342 ◽

2019 ◽

Author(s):

Noriaki Toyoda ◽

Shota Ikeda

Keyword(s):

Low Temperature ◽

Wafer Bonding ◽

Ion Beams ◽

Cluster Ion Beams ◽

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LTB-3D 2019 Preface

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2019.8735254 ◽

2019 ◽

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