2019 20th International Conference on Electronic Packaging Technology(ICEPT)

2019 ◽

Cited By ~ 2

Author(s):

Brian Shieh ◽

Fangyun Zeng ◽

Guoming Yang ◽

Fanny Zhao ◽

Chin-Wei Sher ◽

...

Keyword(s):

Empirical Modeling ◽

Junction Temperature

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Effect of Er2O3 on the properties of AlN ceramics by tape casting

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245173 ◽

2019 ◽

Author(s):

Hong-bo Bai ◽

Xiao-hui Zhang ◽

Ya-guang Wu ◽

Yi-zheng Zhang ◽

Duo Zhao ◽

...

Keyword(s):

Tape Casting

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Thermal Performance Analysis for Multiple Heat Source Power Devices

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245113 ◽

2019 ◽

Author(s):

Yasong Fan ◽

Dongjing Liu ◽

Xiyou Wang ◽

Haojie Wang ◽

Yanchen Wu ◽

...

Keyword(s):

Performance Analysis ◽

Heat Source ◽

Thermal Performance ◽

Power Devices ◽

Source Power

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TSV-defect modeling based electromagnetic full wave analysis and defect diagnosis method design

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245163 ◽

2019 ◽

Author(s):

Yang YANG ◽

Xiaole CUI ◽

Yufeng JIN ◽

Min MIAO ◽

Huan LIU

Keyword(s):

Wave Analysis ◽

Defect Modeling ◽

Full Wave ◽

Full Wave Analysis ◽

Diagnosis Method ◽

Defect Diagnosis

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A bimodal core–shell structured Cu–Ag nanoparticles based conductive ink capable of low temperature sintering for printed flexible electronics

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245273 ◽

2019 ◽

Author(s):

Hai-Jun Huang ◽

Xue Wu ◽

Xiao Ma ◽

Min-Bo Zhou ◽

Xin-Ping Zhang

Keyword(s):

Low Temperature ◽

Flexible Electronics ◽

Ag Nanoparticles ◽

Core Shell ◽

Low Temperature Sintering ◽

Conductive Ink

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A Selective Grafting Method of Polyacrylic Acid Insulation Films on Silicon and Aluminum Surfaces for TSV-CIS Package

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245760 ◽

2019 ◽

Author(s):

Juan Zhuo ◽

Yang Liu ◽

Lishuang Xiong ◽

Yaofang Hu ◽

Liming Gao ◽

...

Keyword(s):

Polyacrylic Acid ◽

Aluminum Surfaces

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A novel pattern printing method of applying Ag nanoparticles to Cu pads for high density Cu-Cu interconnection

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245275 ◽

2019 ◽

Author(s):

Qi Liang ◽

Junjie Li ◽

Tianxiang Li ◽

Tielin Shi ◽

Zirong Tang

Keyword(s):

Ag Nanoparticles ◽

High Density ◽

Printing Method

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A 3-D Thermal Model including thermal coupling for Insulated Gate Bipolar Transistor Module

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245740 ◽

2019 ◽

Author(s):

Wenhao Li ◽

Jianrui Xue ◽

Ming Li ◽

Liming Gao

Keyword(s):

Thermal Model ◽

Bipolar Transistor ◽

Thermal Coupling ◽

Insulated Gate Bipolar Transistor

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Study on Thermal Conductivity of Micro-arc Alumina Substrate for High Power LED

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245198 ◽

2019 ◽

Author(s):

Lei Jiu ◽

Mingqiang Pan ◽

Jun Sheng

Keyword(s):

Thermal Conductivity ◽

High Power ◽

Alumina Substrate ◽

High Power Led

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Effect of TiO2 nanoparticle on intermetallic compounds growth of Cu/Sn/Cu Solder Joint

2019 20th International Conference on Electronic Packaging Technology(ICEPT) ◽

10.1109/icept47577.2019.245272 ◽

2019 ◽

Author(s):

Yanfeng Wang ◽

Shengyan Shang ◽

Haoran Ma ◽

Shaocheng Wu ◽

Weifeng Li ◽

...

Keyword(s):

Solder Joint ◽

Intermetallic Compounds ◽

Tio2 Nanoparticle

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL

Effect of Er2O3 on the properties of AlN ceramics by tape casting

Thermal Performance Analysis for Multiple Heat Source Power Devices

TSV-defect modeling based electromagnetic full wave analysis and defect diagnosis method design

A bimodal core–shell structured Cu–Ag nanoparticles based conductive ink capable of low temperature sintering for printed flexible electronics

A Selective Grafting Method of Polyacrylic Acid Insulation Films on Silicon and Aluminum Surfaces for TSV-CIS Package

A novel pattern printing method of applying Ag nanoparticles to Cu pads for high density Cu-Cu interconnection

A 3-D Thermal Model including thermal coupling for Insulated Gate Bipolar Transistor Module

Study on Thermal Conductivity of Micro-arc Alumina Substrate for High Power LED

Effect of TiO2 nanoparticle on intermetallic compounds growth of Cu/Sn/Cu Solder Joint

Export Citation Format

2019 20th International Conference on Electronic Packaging Technology(ICEPT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL

Effect of Er2O3 on the properties of AlN ceramics by tape casting

Thermal Performance Analysis for Multiple Heat Source Power Devices

TSV-defect modeling based electromagnetic full wave analysis and defect diagnosis method design

A bimodal core–shell structured Cu–Ag nanoparticles based conductive ink capable of low temperature sintering for printed flexible electronics

A Selective Grafting Method of Polyacrylic Acid Insulation Films on Silicon and Aluminum Surfaces for TSV-CIS Package

A novel pattern printing method of applying Ag nanoparticles to Cu pads for high density Cu-Cu interconnection

A 3-D Thermal Model including thermal coupling for Insulated Gate Bipolar Transistor Module

Study on Thermal Conductivity of Micro-arc Alumina Substrate for High Power LED

Effect of TiO2 nanoparticle on intermetallic compounds growth of Cu/Sn/Cu Solder Joint

2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Latest Publications