2019 20th International Conference on Electronic Packaging Technology(ICEPT)
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231
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Published By IEEE

9781728150642
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Investigation on the Interface Thermal Resistance of Copper-Titanium

2019 ◽  
Author(s):  
Yixin Xu ◽  
Fulong Zhu ◽  
Miaocao Wang ◽  
Zilin Lu ◽  
Jianxiong Hu ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Interface Thermal Resistance

Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL

2019 ◽  
Author(s):  
Brian Shieh ◽  
Fangyun Zeng ◽  
Guoming Yang ◽  
Fanny Zhao ◽  
Chin-Wei Sher ◽  
...  
Keyword(s):  
Empirical Modeling ◽  
Junction Temperature

Effect of Er2O3 on the properties of AlN ceramics by tape casting

2019 ◽  
Author(s):  
Hong-bo Bai ◽  
Xiao-hui Zhang ◽  
Ya-guang Wu ◽  
Yi-zheng Zhang ◽  
Duo Zhao ◽  
...  
Keyword(s):  
Tape Casting

Thermal Performance Analysis for Multiple Heat Source Power Devices

2019 ◽  
Author(s):  
Yasong Fan ◽  
Dongjing Liu ◽  
Xiyou Wang ◽  
Haojie Wang ◽  
Yanchen Wu ◽  
...  
Keyword(s):  
Performance Analysis ◽  
Heat Source ◽  
Thermal Performance ◽  
Power Devices ◽  
Source Power
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