The flank faces of diamond cutting tools are characterized by the groove wear when the tools are used to machine single crystal silicon workpieces precisely, which significantly affects the quality of the machined surface. Many researchers confirmed the existence of SiC hard particles and inferred that hard particles scratch led to the groove wear on tools flank face. However, little literature can be found to reveal the formation process of tools groove wear. Therefore, in this paper, a scratch model of SiC hard particles and diamond tool is proposed by molecular dynamics simulation method to investigate the formation mechanism of the groove wear on the tools flank face. The two basic scratch conditions, namely mechanical scratch and rolling scratch, are utilized to simulate hard particles motion on diamond tools surface respectively, and the tools wear are suggested by the variation in coordination numbers. It can be concluded that owing to the high temperature, the locally softened performance of diamond tools combined with continuous effects of SiC hard particles are the main factors that lead to the formation of the groove wear on the tools flank face.
Prediction of temperature distribution in diamond cutting tools during machining Ti-6Al-4V
