Effect of silicon carbide hard particles scratch on the diamond cutting tools groove wear

Author(s):  
Jiachun Wang ◽  
Huarui Chi ◽  
Maoqiang Lv ◽  
Xiaoxuan Liu ◽  
Yuntao Li ◽  
...  

The flank faces of diamond cutting tools are characterized by the groove wear when the tools are used to machine single crystal silicon workpieces precisely, which significantly affects the quality of the machined surface. Many researchers confirmed the existence of SiC hard particles and inferred that hard particles scratch led to the groove wear on tools flank face. However, little literature can be found to reveal the formation process of tools groove wear. Therefore, in this paper, a scratch model of SiC hard particles and diamond tool is proposed by molecular dynamics simulation method to investigate the formation mechanism of the groove wear on the tools flank face. The two basic scratch conditions, namely mechanical scratch and rolling scratch, are utilized to simulate hard particles motion on diamond tools surface respectively, and the tools wear are suggested by the variation in coordination numbers. It can be concluded that owing to the high temperature, the locally softened performance of diamond tools combined with continuous effects of SiC hard particles are the main factors that lead to the formation of the groove wear on the tools flank face.

2014 ◽  
Vol 1017 ◽  
pp. 479-484
Author(s):  
Noritaka Kawasegi ◽  
Kazuma Ozaki ◽  
Noboru Morita ◽  
Kazuhito Nishimura ◽  
Hideki Sasaoka

A focused ion beam (FIB) is an effective means of fabricating micro-to submicro-scale shapes on diamond cutting tools. However, ion irradiation of diamond tools causes ion implantation, defects, and non-diamond phases, all of which degrade the tool performance. To remove affected layers from FIB-irradiated diamond tools, heat treatment in air was applied, and the effect of the heating parameters on the etchability of the irradiated area was investigated. It was found that the affected layer could be etched and removed from the diamond tool surface, even at 500 °C. In machining experiments on aluminum alloy and nickel phosphorus, machining performance was improved by the applied heating technique, and the cutting forces and machined surfaces were similar to those obtained with the non-irradiated tool. These results indicate that the proposed heating technique is effective for diamond cutting tools shaped by FIB.


2007 ◽  
Vol 364-366 ◽  
pp. 544-549
Author(s):  
Ming Chu Kong ◽  
Wing Bun Lee ◽  
Chi Fai Cheung ◽  
Suet To

The formation of tool marks in single-point diamond turning is a fundamental study of the effect of materials swelling and recovery on surface roughness on a machined surface. A series of orthogonal face cutting tests has been conducted among plate aluminum alloy, oxygen-free high conductivity copper and electroless nickel phosphorus under the same cutting conditions by the use of facet tools with different front clearance angles. The results show that the regular width of the undulating pattern in tool marks could be explained by side swelling and the micro-waviness within a tool mark is caused by burnishing and recovery.


2020 ◽  
pp. 2150067
Author(s):  
Ning Chen ◽  
Guoqing Zhang ◽  
Menghua Zhou ◽  
Gang Xu ◽  
Yong Li ◽  
...  

In this study, type Ib, type IIa, and type IIb synthetic diamonds tools were used for the ultra-precision machining (UPM) of copper. Raman spectroscopy showed that the diamond cutting tools used in these experiments exhibited high-quality sp3 structure and little residual stress in the diamond lattice. Type IIb diamond cutting tools showed higher durability and better UPM performance than the other types of diamond cutting tools. Chemical wear was deemed significant with respect to the cutting tools’ wear in this UPM experiment. Higher durability and enhanced UPM performance could be attributed to the higher thermal and chemical stabilities of the type IIb diamond cutting tool.


2012 ◽  
Vol 523-524 ◽  
pp. 81-86 ◽  
Author(s):  
Yuya Kobaru ◽  
Eiji Kondo ◽  
Ryuichi Iwamoto

A lot of studies on the ultra-precision cutting of single crystal silicon have been reported and they used the single crystal diamond cutting tools having the sharp cutting edge. However, the diamond cutting tools having small chamfer at the cutting edge are usually used in practical machining shops. In addition, studies on the relationship between the tool wear and the machined surface have been reported little although the relationship is important in practical applications. In this study, ultra-precision cutting of single crystal silicon, using cutting fluids, feed rate, and depth of cut as experimental parameters, were carried out by using the single crystal diamond cutting tools having small chamfer and large nose radius, and effects of the cutting fluids, the feed rate, and the depth of cut on the machining accuracy and tool wear were studied. As a result, the optimum cutting conditions was obtained as follows: the cutting fluid was kerosene, the feed rate was 2.0μm/rev, and the depth of cut was 1.0μm.


2017 ◽  
Vol 26 (8) ◽  
pp. 4046-4055 ◽  
Author(s):  
G. Miranda ◽  
P. Ferreira ◽  
M. Buciumeanu ◽  
A. Cabral ◽  
M. Fredel ◽  
...  

2020 ◽  
Vol 109 ◽  
pp. 108025
Author(s):  
Feng Chen ◽  
Zhiqiao Yan ◽  
Zhenpeng Liu ◽  
Ying Long ◽  
Naike Fu ◽  
...  

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