Elaboration of fracture prediction map using 2D digital image correlation - 2D CID

This work aims to present a methodology for the elaboration of a deformation map in a Portland cement concrete specimen to predict fractures caused by axial compression stresses, using the technique of Digital Image Correlation - DIC 2D. For this purpose, 5 concrete specimens with compressive strength expected at 28 days fck of 40 MPa were analyzed, which were tested in the ABNT NBR 5739/2018 standard - compression test of cylindrical concrete specimens. During the test, the necessary digital images were acquired in the DIC-2D array. These images were subsequently processed, and the results interpreted statistically. According to the result of the correlation of images obtained, it was found that 67% of the specimens had regions of accumulation of stresses that indicated in advance the location of the rupture, which enabled the development of a fracture prediction map. The results obtained in the research showed that the methodology used by means of the DIC-2D arrangement was able to predict the place where the rupture in the specimens occurred.

Programmable quantum simulator boasts up to 256 qubits

Physicists have demonstrated a largescale, programmable quantum simulator that features a 2D array of 256 quantum bits (qubits).

The congruent number problem

The congruent number problem is the oldest unsolved major mathematical problem to date. The problem aiming to determine whether or not some given integer n is congruent, which corresponds to a Pythagorean triangle with integer sides, can be settled in a finite number of steps. However, once we permit the triangles to acquire rational values for its sides, the degree of difficulty of the task changes dramatically. In this paper a basis is developed, to produce right Pythagorean triangles with rational sides and integral area in a straightforward manner. Determining whether or not a given natural number n is congruent, is equivalent to a search through an ordered 2D array.

A MEMS Ultra-Wideband (UWB) Power Sensor with a Fe-Co-B Core Planar Inductor and a Vibrating Diaphragm Capacitor

The design of a microelectromechanical systems (MEMS) ultra-wideband (UWB) RMS power sensor is presented. The sensor incorporates a microfabricated Fe-Co-B core planar inductor and a microfabricated vibrating diaphragm variable capacitor on adhesively bonded glass wafers in a footprint area of 970 × 970 µm2 to operate in the 3.1–10.6 GHz UWB frequency range. When exposed to a far-field UWB electromagnetic radiation, the planar inductor acts as a loop antenna to generate a frequency-independent voltage across the MEMS capacitor. The voltage generates a coulombic attraction force between the diaphragm and backplate that deforms the diaphragm to change the capacitance. The frequency-independent capacitance change is sensed using a transimpedance amplifier to generate an output voltage. The sensor exhibits a linear capacitance change induced voltage relation and a calculated sensitivity of 4.5 aF/0.8 µA/m. The sensor can be used as a standalone UWB power sensor or as a 2D array for microwave-based biomedical diagnostic imaging applications or for non-contact material characterization. The device can easily be tailored for power sensing in other application areas such as, 5G, WiFi, and Internet-of-Things (IoT). The foreseen fabrication technique can rely on standard readily available microfabrication techniques.

Development of Broadband High-Frequency Piezoelectric Micromachined Ultrasonic Transducer Array

Piezoelectric micromachined ultrasonic transducers (PMUT) are promising elements to fabricate a two-dimensional (2D) array with a pitch small enough (approximately half wavelength) to form and receive arbitrary acoustic beams for medical imaging. However, PMUT arrays have so far failed to combine the wide, high-frequency bandwidth needed to achieve a high axial resolution. In this paper, a polydimethylsiloxane (PDMS) backing structure is introduced into the PMUTs to improve the device bandwidth while keeping a sub-wavelength (λ) pitch. We implement this backing on a 16 × 8 array with 75 µm pitch (3λ/4) with a 15 MHz working frequency. Adding the backing nearly doubles the bandwidth to 92% (−6 dB) and has little influence on the impulse response sensitivity. By widening the transducer bandwidth, this backing may enable using PMUT ultrasonic arrays for high-resolution 3D imaging.