elliptic inhomogeneity
Recently Published Documents


TOTAL DOCUMENTS

36
(FIVE YEARS 1)

H-INDEX

10
(FIVE YEARS 0)

2019 ◽  
Vol 72 (4) ◽  
pp. 429-447 ◽  
Author(s):  
K Song ◽  
H P Song ◽  
P Schiavone ◽  
C F Gao

Summary Thermal stress induced by an uneven temperature field and mismatched thermal expansion is known to be a dominating factor in the debonding mechanism that threatens reliability and ultimately leads to failure in thermoelectric (TE) composites. Accordingly, we analyse the stress distributions in a TE composite induced by the presence of an elliptic inhomogeneity embedded in the surrounding matrix material. Using complex variable methods, we obtain closed-form representations of the thermal–electric and thermal–elastic fields and find that the temperature field around the inhomogeneity is reduced dramatically by the application of a remote electric current density without affecting the temperature difference across the inhomogeneity–matrix interface. This ensures the conversion efficiency of the TE composite while improving its reliability. Numerical results illustrate that a suitable choice of electric current density can prevent interfacial debonding via the suppression of the maximum positive normal stress on the interface.



Author(s):  
K. Song ◽  
H.P. Song ◽  
M. Li ◽  
P. Schiavone ◽  
C.F. Gao


2013 ◽  
Vol 224 (11) ◽  
pp. 2863-2880 ◽  
Author(s):  
Z. Q. Huang ◽  
G. H. Nie ◽  
C. K. Chan




Sign in / Sign up

Export Citation Format

Share Document